論文リスト

投稿論文

  • Sn-Sb-Ag 系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響
    山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
    スマートプロセス学会誌, Vol.11, No.5, pp.194-201 (2022)
  • 半導体パッケージ検査用プローブ材と Sn-58Bi はんだ界面における反応層成長過程
    渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁
    スマートプロセス学会誌, Vol.11, No.5, pp.188-193 (2022)
  • Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder
    Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida, Dmitri Golberg and Ikuo Shohji
    Materials Transactions, Vol.63, No.8, pp.1112-1119 (2022)
    【DOI:10.2320/matertrans.MT-MC2022010】
  • Microstructure and Thermal Cycle Reliability of Sn­Ag­Cu­In­Sb Solder Joint
    Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Masaaki Sarayama, Makoto Iioka and Ikuo Shohji
    Materials Transactions, Vol.63, No.7, pp.1021-1027 (2022) 
    【DOI:10.2320/matertrans.MT-MC2022013】
  • Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid
    Shinji Koyama, Ikuo Shohji and Takako Muraoka
    Materials Transactions, Vol.63, No.7, pp.987-992 (2022)  
    【DOI:10.2320/matertrans.MT-MC2022014】
  • An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating
    Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi
    Materials Transactions, Vol.63, No.6, pp.821-828 (2022)  
    【DOI:10.2320/matertrans.MT-MC2022012】
  • Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications
    Shinji Koyama, Ikuo Shohji and Takako Muraoka
    Materials Transactions, Vol.63, No.6, pp.813-820 (2022)  
    【DOI:10.2320/matertrans.MT-MC2022007】
  • Formation of Cu­Ni Alloy Plating Film for Improving Adhesion between Metal and Resin
    Tatsuya Kobayashi, Akifumi Kubo and Ikuo Shohji
    Materials Transactions, Vol.63, No.6, pp.800-804 (2022)  
    【DOI:10.2320/matertrans.MT-MC2022002】
  • Investigation of Mechanical Properties of High Tg Epoxy Resin Material
    Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI
    スマートプロセス学会誌, Vol.10, No.6, pp.365-371 (2021)
  • 電子実装用エポキシ樹脂および Ni/ 樹脂接着部の吸水劣化挙動
    三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也
    スマートプロセス学会誌, Vol.10, No.6, pp.359-364 (2021)
  • Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits
    Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,
    Hiroki Yamamoto, Yuichiro Kamakoshi
    Journal of Electroanalytical Chemistry, 897, 115582 (2021)
    【DOI: https://doi.org/10.1016/j.jelechem.2021.115582】
  • Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment
    Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and
    Yuichiro Kamakoshi
    Materials, 14, 4237 (2021) 
    【DOI:https://doi.org/10.3390/ma14154237】
  • Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited
    Ni-Cr-P Alloy Coating
    Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake,
    Katsufumi Inoue and Hiroki Yamamoto
    Materials, 14, 4216 (2021) 
    【DOI:https://doi.org/10.3390/ma14154216】
  • Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated
    by Friction Stir Spot Welding
    Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi
    Materials, 14, 3877 (2021)  【DOI:https://doi.org/10.3390/ma14143877】
  • Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag
    Lead-Free Solder
    Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe
    Materials, 14, 3799 (2021)  
    【DOI:https://doi.org/10.3390/ma14143799】
  • Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded
    via Foaming Bonding
    Ryosuke Suzuki, Yoshihiko Hangai, Yusuke Asakawa, Ikuo Shohji, Hidetoshi Fujii, Masaaki Matsubara
    Material Transactions, Vol.62, No.8, pp.1210-125 (2021)  
    【DOI:https://doi.org/10.2320/matertrans.MT-M2020393】
  • Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film
    T. Kobayashi & I. Shohji
    Materials and Manufacturing Processes (2021)
    【DOI:10.1080/10426914.2021.1885708】
  • Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint with Surface Treatment
    UsingElectrolyzed Water
    Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai
    Materials Science Forum, Vol. 1016, pp. 1466-1472 (2021)
  • Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High
    Temperature andHigh Humidity Aging
    Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka
    Materials Science Forum, Vol. 1016, pp. 1436-1442 (2021)
  • Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding for Multi-Material
    Components
    Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota
    Materials Science Forum, Vol. 1016, pp. 774-779 (2021)
  • Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition for joining
    dissimilar materials
    Tatsuya Kobayashi, Ikuo Shohji
    Materials Science Forum, Vol. 1016, pp. 738-743 (2021)
  • Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder
    Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji
    Materials Science Forum, Vol. 1016, pp. 553-560 (2021)
  • Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior
    Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai,
    Yuichiro Kamakoshi
    Materials Science Forum, Vol. 1016, pp. 522-527 (2021)
  • 縦型双ロ-ルキャスティングを用いたプリカーサ法によるポーラスアルミニウム合金の製作
    鈴木良祐, 増渕匠, 西田進一, 荘司郁夫, 半谷禎彦, 藤井英俊, 松原雅昭
    鋳造工学, 第92巻, 第11号, pp.577-582 (2020)
  • Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響
    三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦
    スマートプロセス学会誌, Vol.9, No.3, pp.133-139 (2020)
  • ステンレス鋼製熱交換器用Niろうの腐食挙動
    深井祐佑, 荘司郁夫, 小林竜也, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇
    スマートプロセス学会誌, Vol.9, No.3, pp.127-132 (2020)
  • 接着継手の高温高湿環境下における樹脂材凝集力および接着界面の劣化挙動調査
    安孫子瞳, 荘司郁夫, 小林竜也, 冨田雄吾, 松永達則
    スマートプロセス学会誌, Vol.9, No.2, pp.75-81 (2020)
  • Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with
    Small Amount of Ni Using Miniature Size Specimens
    Tatsuya Kobayashi, Ikuo Shohji
    Metals 2019, Volume 9, Issue 12, 1348 (2019)
  • Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder
    Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo Shohji
    Applied Sciences, 9(13), 2724 (2019)
  • Effect of Bi addition on Tensile Properties of Sn-Ag-Cu Solder at Low Temperature
    Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji
    Materials Transactions, Vol.60, No.6, pp.909-914 (2019)
  • Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and
    Mechanical Properties
    Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji
    Materials Transactions, Vol.60, No.6, pp.888-894 (2019)
  • 超音波フリップチップボンディングのチップ傾斜に対するロバスト性改善
    冨岡泰造,井口知洋,荘司郁夫
    塑性と加工, Vol.60, No.700, pp.142-146 (2019)
  • Bondability Investigations of Thermosonic Flip Chip Bonding using Ultrasonic Vibration Perpendicular
    to the Interface
    Taizo Tomioka, Ikuo Shohji
    Transactions of the Japan Institute of Electronics Packaging, Vol.12, E18-013, 7 pages (2019)
  • Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating
    Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi, Tsunehito Wake and Susumu Arai
    Applied Sciences, 9(6),1094 (2019)
  • Finite Element Method Analysis of Densification Process of Sintered Steelfor Automobile in Cold Forging
    Y. Morokuma, Y. Kamakoshi, S.Nishida, I. Shohji
    International Journal of Technology and Engineering Studies, Vol. 5, Issue 1, pp. 30-36 (2019)
  • A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint
    Yusuke Nakata, Motoki Kurasawa, Tomihito Hashimoto, Kenji Miki and Ikuo Shohji
    Materials Science Forum, Vol. 941, pp.2087-2092 (2018)
  • Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder
    Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji
    Materials Science Forum, Vol. 941, pp.2081-2086 (2018)
  • Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder
    Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata
    Materials Science Forum, Vol. 941, pp.2075-2080 (2018)
  • Investigation of Crack Initiation in Glass Substrate by Residual Stress Analysis
    Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura
    Materials Science Forum, Vol. 941, pp.2069-2074 (2018)
  • Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process
    Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, Tatsuya Kobayashi and Ikuo Shohji
    Materials Science Forum, Vol. 941, pp.552-557 (2018)
  • Microstructures and Mechanical Properties of Welded Joints of Several High Tensile Strength Steel
    Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga
    Materials Science Forum, Vol. 941, pp.224-229 (2018)
  • Mo 系低合金焼結鋼の靱性および疲労強度向上のための焼結冷間鍛造工法と浸炭熱処理条件の最適化
    鎌腰雄一郎, 荘司郁夫, 井上紀子, 福田俊二
    スマートプロセス学会誌, Vol.7, No.6, pp.251-259 (2018)
  • 鋳造プリカーサ法によるポーラスアルミニウムの作製
    鈴木良祐, 西本拓真, 半谷禎彦, 荘司郁夫, 松原雅昭
    日本金属学会誌, 第82巻, 第9号, pp.349-357(2018)
  • 高温高湿環境下における銅/エポキシ樹脂界面の劣化寿命評価
    戸野塚悠, 小林竜也, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳
    スマートプロセス学会誌, Vol.7, No.4, pp.128-134 (2018)
  • Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size
    Specimens
    Tatsuya Kobayashi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
    Advances in Materials Science and Engineering, Volume 2018, Article ID 1416942 (2018)
  • Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder
    Joints
    Tatsuya Kobayashi, Ikuo Shohji, and Yusuke Nakata
    Advances in Materials Science and Engineering, Volume 2018, Article ID 4829508 (2018)
  • Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens
    Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
    Solid State Phenomena, Vol. 273, pp.83-90 (2018)
  • 荷重プロファイルが超音波フリップチップボンディングの接合性へ与える影響
    冨岡 泰造, 井口 知洋, 荘司 郁夫
    溶接学会論文集, 第36巻, 第1号, pp.16-20(2018)
  • Formation mechanism of pillar-shaped intermetallic compounds dispersed lead-free solder joint
    Y Nakata, T Hashimoto, M Kurasawa, Y Hayashi, and I Shohji
    IOP Conf. Series: Materials Science and Engineering 257 (2017) 012014
  • Finite element method analysis of cold forging for deformation and densification of Mo alloyed sintered
    steel
    Y Kamakoshi, S Nishida, K Kanbe and I Shohji
    IOP Conf. Series: Materials Science and Engineering 257 (2017) 012012
  • Improvement of mechanical strength of sintered Mo alloyed steel by optimization of sintering
    and cold-forging processes with densification
    Y Kamakoshi, I Shohji, Y Inoue and S Fukuda
    IOP Conf. Series: Materials Science and Engineering 257 (2017) 012011
  • The effect of boriding on wear resistance of cold work tool steel
    Y. Anzawa, S. Koyama and I. Shohji
    Journal of Physics: Conf. Series 843 (2017) 012064
  • Liquid phase diffusion bonding of A1070 by using metal formate coated Zn sheet
    K. Ozawa, S. Koyama and I. Shohji
    Journal of Physics: Conf. Series 843 (2017) 012005
  • 金属塩被膜付与Znシートを用いた鋳造用Al合金の液相拡散接合
    西城舜哉, 小山真司, 荘司郁夫
    スマートプロセス学会誌, Vol.6, No.5, pp.195-199 (2017)
  • Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper
    Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani, Yukio Inoue
    Procedia Engineering 184, pp.743–749 (2017)
  • Change of Crystallographic Orientation Characteristics of (001)-Oriented Electrodeposited Silver Films
    during Self-Annealing at Room Temperature
    Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
    Procedia Engineering 184, pp.725–731 (2017)
  • Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper under Aging at High
    Temperature
    Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
    Procedia Engineering 184, pp.648–654 (2017)
  • Liquid Phase Diffusion Bonding of AC2C/ADC12 Aluminum Casting Alloy by Using Metal Salt Coated
    Zn Sheet
    Shunya Saijo, Shinji Koyama, Ikuo Shohji
    Procedia Engineering 184, pp.284-289 (2017)
  • Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue
    Conditions
    Kyosuke Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
    Procedia Engineering 184, pp.238–245 (2017)
  • Degradation Behaviors of Adhesion Strength of Structural Adhesive for Weld-Bonding under High
    Temperatureand Humidity Conditions
    Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
    Procedia Engineering 184, pp.231–237 (2017)
  • Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper
    Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
    Procedia Engineering 184, pp.223–230 (2017)
  • Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped
    IMCs
    Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomihito Hashimoto
    Procedia Engineering 184, pp.214–222 (2017)
  • Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder
    Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono
    Materials Science Forum, Vol. 879, pp.2377-2382 (2016)
  • Comparison of Self-Annealing Behaviors in (001)- and (111)-Oriented Electrodeposited Silver Films by
    In Situ EBSP Analysis
    Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
    Materials Science Forum, Vol. 879, pp.2243-2248 (2016)
  • Effect of Added Elements on Microstructures and Joint Strength ofLead-free Sn-Based Solder Joint
    Dispersed IMC Pillar
    Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto
    Materials Science Forum, Vol. 879, pp.2216-2221 (2016)
  • ピラー状IMC分散鉛フリーはんだ接合
    中田裕輔, 橋本富仁, 林和, 荘司郁夫
    スマートプロセス学会誌, Vol.5, No.5, pp.309-314 (2016)
  • Microstructure and electrochemical corrosion behavior of Fe-Cr system alloys as substitutes for Ni-based
    brazing filler metal
    K.D. Shi, T. Tsunoda, I. Shohji, K. Matsu and Y. Taguchi
    Acta Metallurgica Sinica(English Letters), 29-8, pp.697-706 (2016)
  • Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization
    Hanae Hata, Yuuki Maruya and Ikuo Shohji
    Materials Transactions, Vol. 57, No. 6, pp.887-891 (2016)
  • Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder
    Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
    Materials Transactions, Vol. 57, No. 6, pp.873-880 (2016)
  • In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD
    Method
    Yumi Hayashi, Hiroshi Miyazawa, Kohei Minamitani and Ikuo Shohji
    Materials Transactions, Vol. 57, No. 6, pp.815-818 (2016)
  • Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler
    Shinji Koyama, Issei Oya and Ikuo Shohji
    Materials Transactions, Vol. 57, No. 6, pp.810-814 (2016)
  • Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability of the Solder Joint
    Hanae Shimokawa, Tasao Soga, Koji Serizawa, Kaoru Katayama and Ikuo Shohji
    Transactions of the Japan Institute of Electronics Packaging, Vol. 8, No. 1, pp.46-54 (2015)
  • Fe-Cr 系ろうによる SUS304 ステンレス鋼ろう付継手の接合強度
    石康道, 角田貴宏, 楠元一臣, 荘司郁夫, 松康太郎, 田口育宏
    スマートプロセス学会誌, Vol. 4, No. 5, pp.247-253 (2015)
  • Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed with Fe-Cr System Alloy
    Kangdao Shi, Takahiro Tsunoda, Kazuomi Kusumoto, Ikuo Shohji, Kotaro Matsu and Yasuhiro Taguchi
    Journal of Smart Processing - for Materials, Environment & Energy -, Vol. 4, No. 4, pp.215-221 (2015)
  • Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Organic Acid and Its
    Persistence of Reformed Layer
    Shinji Koyama, Naoki Hagiwara and Ikuo Shohji
    Japanese Journal of Applied Physics, vol. 54, pp.030216-1-030216-4 (2015)
  • Effect of Filler Content and Coupling Agent on Mechanical Properties of Underfill Material
    Hironao Mitsugi, Shinya Kitagoh, Ikuo Shohji and Shinji Koyama
    Transactions of the Japan Institute of Electronics Packaging, Vol. 7, pp.25-31 (2014)
  • 銀めっき膜の{200}配向に及ぼす高シアン液中セレンの影響
    宮澤寛, 尾形雅史, 篠原圭介, 菅原章, 荘司郁夫
    銅と銅合金, Vol. 53, No. 1, pp.266-271 (2014)
  • Sn-3Ag-0.5Cu はんだと W 基板上めっきメタライズ界面に生成する Sn-W 構造
    依田智子, 原田正英, 西川徹, 小林竜也, 荘司郁夫
    スマートプロセス学会誌, Vol. 3, No. 4, pp.232-239 (2014)
  • Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid
    Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda and Ikuo Shohji
    Advanced Materials Research, Vol. 922, pp.491-496 (2014)
  • Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid
    Naoki Hagiwara, Shinji Koyama and Ikuo Shohji
    Advanced Materials Research, Vol. 922, pp.219-223 (2014)
  • Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-free Alloys
    Ikuo Shohji and Yuichiro Toyama
    Materials Science Forum, Vol. 783-786, pp.2810-2815 (2014)
  • Effect of Se content in high-cyanide silver plating solution on {200} crystal plane orientation ratio
    of electrodeposited silver layer
    Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and Ikuo Shohji
    Materials Science Forum, Vol. 783-786, pp.1458-1463 (2014)
  • フリップチップ接合用材料の機械的特性がフリップチップのパッド下部配線層の熱応力に与える影響
    久田隆史, 荘司郁夫, 山田靖治, 藤本公三
    スマートプロセス学会誌, Vol. 3, No. 1, pp.47-53 (2014)
  • A Study of the Effect of Indium Filler Metal on the Bonding Strength of Copper and Tin
    Shinji Koyama, Seng Keat Ting, Yukinari Aoki and Ikuo Shohji
    Transactions of the Japan Institute of Electronics Packaging, 6(1), pp.93-98 (2013)
  • Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength of Solid-State Bonded
    Interface of Al
    Shinji Koyama, Ting Seng Keat, Shun Amari, Kouta Matsubara and Ikuo Shohji
    Materials Transactions, 54, No. 10, pp.1975-1980 (2013)
  • 鉛フリー無電解Ni めっき皮膜中の共析物がはんだ実装信頼性に及ぼす影響
    土田徹勇起, 大久保利一, 狩野貴宏, 荘司郁夫
    エレクトロニクス実装学会誌, 16, [6], pp.484-491 (2013)
  • Sn-Ag-Cu-Ni系鉛フリーはんだ接合部の接合特性に及ぼすGeおよびP添加の影響
    荘司郁夫, 渡邉裕彦, 新井亮平
    電子情報通信学会論文誌 C Vol.J95-C, No. 11, pp.324-332 (2012)
  • Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating against Lead-free Solder
    J. Watanabe, N. Sekimori, K. Hatsuzawa, T. Uetani and I. Shohji
    Journal of Physics: Conference Series, 379 (2012) 012025
  • SUS304ステンレス鋼のB添加溶融塩浴を用いたほう化処理に及ぼす処理温度の影響
    小山真司, 福田達也, 川澄健太郎, 荘司郁夫
    日本金属学会誌,75, [12], pp.684-689 (2011)
  • SUS304ステンレス鋼のほう化処理に及ぼす溶融塩浴中のB添加量の影響
    小山真司, 高田大士, 川澄健太郎, 福田達也, 荘司郁夫
    日本金属学会誌,75, [12], pp.678-683 (2011)
  • Al添加溶融ほう砂浴を用いたSUS304ステンレス鋼のほう化処理に及ぼす処理温度の影響
    小山真司, 川澄健太郎, 福田達也, 荘司郁夫
    日本機械学会論文集(A編), 77,[783], pp.1986-1993 (2011)
  • レーザ変位法を用いたソルダペーストぬれ性評価装置の開発
    荘司郁夫, 小山真司, 大屋一生, 伊坂俊宏, 宮本博永, 西室将, 平本清
    エレクトロニクス実装学会誌, 14, [5], pp.390-393 (2011)
  • Sn-Cu-Ni系およびSn-Zn系鉛フリーはんだへのCuの溶解特性
    荘司郁夫, 渡邉裕彦, 永井麻里江, 大澤勤
    エレクトロニクス実装学会誌, 14, [5], pp.382-389 (2011)
  • Sn/Ni接合界面の引張強さに及ぼすInフィラーメタルの適用効果
    小山真司, 伊坂俊宏, 荘司郁夫
    エレクトロニクス実装学会誌, 14, [5], pp.377-381 (2011)
  • Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu
    Solder Ball
    Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
    Key Engineering Materials, 462-463, pp.849-854 (2011)
  • Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni addition
    Hirohiko Watanabe, Masayoshi Shimoda, Noboru Hidaka and Ikuo Shohji
    Key Engineering Materials, 462-463, pp.247-252 (2011)
  • Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge Alloy
    Ikuo Shohji, Ryohei Arai, Hisao Ishikawa and Masao Kojima
    Key Engineering Materials, 462-463, pp.82-87 (2011)
  • Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package
    Solder Joints
    Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
    Key Engineering Materials, 462-463, pp.76-81 (2011)
  • Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy
    Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa and Ikuo Shohji
    Key Engineering Materials, 462-463, pp.70-75 (2011)
  • Cu-Sn-Zr-P Alloy for High-Strength Heat Exchanger Tube
    Tetsuya Ando, Hirokazu Tamagawa and Ikuo Shohji
    Transactions of the Japan Institute of Electronics Packaging, 3, pp.14-17 (2010)
  • Effect of Formic Acid Surface Modification on Bond Strength of Solid-State bonded Interface of Tin and
    Copper
    Shinji Koyama, Yukinari Aoki and Ikuo Shohji
    Materials Transactions, 51, No.10, pp.1759-1763 (2010)
  • Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-free Sn-Cu Foil
    Ikuo Shohji, Shinji Koyama, Itaru Oshiro, Hideaki Nara and Yoshiharu Iwata
    Materials Transactions, 51, No.10, pp.1753-1758 (2010)
  • Boron Particle Composite Plating with Ni-B Alloy Matrix
    Susumu Arai, S Kasai and Ikuo Shohji
    Journal of The Electrochemical Society, 157, pp.D119-D125 (2010)
  • Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder
    Ikuo Shohji, Kazuhito Sumiyoshi and Makoto Miyazaki
    Transactions of the Japan Institute of Electronics Packaging, 2, pp.35-39 (2009)
  • Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb Solder for Aerospace
    Application
    Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara and Fusao Iwase
    Transactions of the Japan Institute of Electronics Packaging, 2, pp.29-34 (2009)
  • Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
    Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
    Journal of The Electrochemical Society, 156, pp.D283-D286 (2009)
  • Effect of Shear Speed on Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joint
    Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
    Transactions of the Japan Institute of Electronics Packaging, 1, pp.9-14 (2008)
  • Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint
    Ikuo Shohji, Tsutomu Osawa, Takeshi Okashita and Hirohiko Watanabe
    Key Engineering Materials, Vol.385-387, pp.745-748 (2008)
  • Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint
    Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano
    Key Engineering Materials, Vol.385-387, pp.433-436 (2008)
  • Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints
    Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
    Key Engineering Materials, Vol.385-387, pp.429-432 (2008)
  • Impact Properties of Lead-free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
    Ikuo Shohji, Hirohiko Watanabe, Takeshi Okashita and Tsutomu Osawa
    Materials Transactions, Vol.49, No.7, pp.1513-1517 (2008)
  • Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles
    Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
    Journal of The Surface Finishing Society of Japan, Vol.59, No.5, pp.343-345 (2008)
  • Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using
    Strain Rate Sensitivity Index
    Kiyokazu Yasuda, Ikuo Shohji and Tadashi Takemoto
    Materials Science Forum, Vol.580-582, pp.221-224 (2008)
  • Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-free Solders
    Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto
    Materials Transactions, Vol.49, No.5, pp.1175-1179 (2008)
  • Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package Solder Joints
    Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano
    Smart Processing Technology, Vol.2, pp.111-114 (2008)
  • Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn Solder Joints on Electroless
    Ni/Au Plated Electrodes
    Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
    Smart Processing Technology, Vol.2, pp.103-106 (2008)
  • Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size
    Specimens
    Ikuo Shohji, Tsutomo Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto
    Smart Processing Technology, Vol.2, pp.99-102 (2008)
  • アンダーフィル封止CSP鉛フリーはんだ接合部の熱疲労寿命評価
    東平知丈, 荘司郁夫, 吉澤啓介, 西元正治, 川野崇之, 水谷弓子, 大崎理彦
    日本金属学会誌,Vol.72, No.3, pp.244-248 (2008)
  • 無電解Ni-Pめっき処理アルミニウム合金とポリアセタールとの摩耗特性
    荘司郁夫, 新井進, 内川順一, 松井孝典, 小林栄仁
    表面技術,第58巻,第12号,pp.846-847 (2007)
  • Cu-P複合めっき膜のろう付特性に及ぼす添加P粒子径の影響
    荘司郁夫, 新井進, 狩野直樹, 上西正久, 大友昇
    表面技術,第58巻,第12号,pp.831-835 (2007)
  • Influence of Content of Ni and Ag on Microstructure and Joint Strength of Sn-Ag-Cu-Ni-Ge Lead-Free
    Solder Joint
    Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe and Tatsuhiko Asai
    Key Engineering Materials, Vol.353-358, pp.2033-2036 (2007)
  • Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size
    Package
    Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano
    Key Engineering Materials, Vol.353-358, pp.2029-2032 (2007)
  • Development of Cu Brazing Sheet with Cu-P Composite Plating
    Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo and Masahisa Uenishi
    Key Engineering Materials, Vol.353-358, pp.2025-2028 (2007)
  • スクリーン印刷用電鋳Ni-Co合金メッシュの耐刷性
    荘司郁夫, 村田陽三, 山本亮, 佐々木信夫, 外舘公生
    エレクトロニクス実装学会誌,10, [6], pp.491-494 (2007)
  • Cu-P複合めっき
    新井進, 鈴木陽介, 飯高正裕, 荘司郁夫, 上西正久, 大友昇
    表面技術,第58巻,第2号,pp.139-141 (2007)
  • An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-free Solder Using Surface
    Deformation
    Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
    Key Engineering Materials, Vol.326-328, pp.1035-1038 (2006)
  • Sn-3.5Ag,Sn-0.7Cu鉛フリーはんだの表面変形度合いによる低サイクル疲労寿命の定義
    高橋武彦, 日置進, 荘司郁夫, 神谷修
    溶接学会論文集,第24巻,第3号, pp.253-258 (2006)
  • Thermal stress relief in lead-free solder joint for chip size package with encapsulant materials
    Ikuo Shohji, Keisuke Yosizawa, Masaharu Mishimoto and Takayuki Kawano
    Smart Processing Technology, Vol.1, pp.175-178 (2006)
  • 合金としてのウイスカ抑制Pbフリーはんだ
    林田喜任, 髙橋義之, 大野隆生, 荘司郁夫
    日本金属学会誌, Vol.70, No.3, pp.220-225 (2006)
  • Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-free Solder
    Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
    Key Engineering Materials, Vol.306-308, pp.115-120 (2006)
  • Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-free Alloy under Heat Exposure Conditions
    Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe, Tatsuhiko Asai and Megumi Nagano
    Materials Transactions, Vol.46, No.12, pp.2737-2744 (2005)
  • Comaprison of Immersion Gold Plating in Reliability of a Lead-free Solder Joint with Autocatalytic
    Electroless Gold Plating
    Kiyotomo Nakamura, Toshikazu Ookubo, Ikuo Shohji and Hiroki Goto
    Materials Transactions, Vol.46, No.12, pp.2730-2736 (2005)
  • Influence of an Immersion Gold Plating Layer on Reliability of a Lead-free Solder Joint
    Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
    Materials Transactions, Vol.46, No.12, pp.2725-2729 (2005)
  • Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu solders
    Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
    Materials Transactions, Vol.46, No.11, pp.2335-2343 (2005)
  • Estimation of Thermal Fatigue resistances of Sn-Ag and Sn-Ag-Cu Lead-free Solders using Strain Rate
    Sensitivity Index
    Ikuo Shohji, Kiyokazu Yasuda and Tadashi Takemoto
    Materials Transactions, Vol.46, No.11, pp.2329-2334 (2005)
  • Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with
    Sn-3Ag-0.5Cu
    Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
    Key Engineering Materials, Vol.297-300, pp.2864-2869 (2005)
  • High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for
    High-Frequency Chip Coil
    Ikuo Shohji, Tsukasa Sakurai and Shinji Arai
    Key Engineering Materials, Vol.297-300, pp.2819-2824 (2005)
  • Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base Filler Metals Added Cr
    Powder
    Ikuo Shohji, Satoshi Takayama, Takanori Nakazawa, Ken Matsumoto and Masanori Hikita
    Key Engineering Materials, Vol.297-300, pp.2767-2771 (2005)
  • Sn-0.7Cu鉛フリーはんだの低サイクル疲労特性および画像を用いた疲労被害評価
    高橋武彦, 日置進, 荘司郁夫, 神谷修
    溶接学会論文集,第23巻 第3号,pp.436-441 (2005)
  • 高周波巻線チップコイル用被覆銅線の超音波接合
    荘司郁夫, 新井慎二, 櫻井司, 久米原宏之, 薄波圭司, 木村由孝, 須齋嵩
    エレクトロニクス実装学会誌 7, [7], pp.622-628 (2004)
  • Tensile Properties of Sn-0.7mass%Cu Lead-free Solder
    Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
    Transactions of Materials Research Society of Japan, Volume 29 - No.5, pp.2001-2004 (2004)
  • Creep Properties of Sn-8mass%Zn-3mass%Bi Lead-free Alloy
    Ikuo Shohji, Colin Gagg and William J. Plumbridge
    Journal of Electronic Materials, Vol. 33, No.8, pp.923-927 (2004)
  • Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls
    Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira Ichida
    Materials Transactions, Vol.45, No.3,pp.754-758 (2004)
  • 熱交換機用ステンレス鋼のNiろう接合継手の強度と組織
    高山智司, 有倉洋平, 荘司郁夫, 中澤崇徳, 松本健, 曳田昌徳
    日本金属学会誌,第68巻,第2号,pp.130-133 (2004)
  • Comparison of Low-melting Lead-free Solders in Tensile Properties with Sn-Pb Eutectic Solder
    Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
    Journal of Materials Science: Materials in Electronics, 15-4, pp.219-223 (2004)
  • Solder Joint Reliability Evaluation of Chip Scale Package using a Modified Coffin-Manson Equation
    Ikuo Shohji, Hideo Mori and Yasumitsu Orii
    Microelectronics Reliability, 44, pp.269-274 (2004)
  • ソルダ供給量に及ぼすソルダペースト中の平均粒径の影響
    荘司郁夫, 白鳥祐司, 宮崎誠
    エレクトロニクス実装学会誌 7, [1], pp.62-66 (2004)
  • Tensile Properties of Sn-Ag Based Lead-free Solders and Strain Rate Sensitivity
    Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
    Materials Science and Engineering A, Vol. 366-1, pp.50-55 (2004)
  • Microstructures and Hardness of Mo Heater Chip Brazed with Au-18mass%Ni
    Ikuo Shohji, Yoshinori Kawabata and Yoshitaka Kimura
    Materials Transactions, Vol.44, No.5, pp.866-869 (2003)
  • Cu-7mass%PろうによるSUS316鋼のろう付組織と機械的特性
    荘司郁夫, 藤平光宏, 大金彰, 中澤崇徳, 上西正久, 大友昇
    溶接学会論文集,第20巻 第4号,pp.517-522 (2002)
  • Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-Free Solders
    Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
    Materials Transactions, Vol.43, No.8, pp.1854-1857 (2002)
  • Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu Joints
    Ikuo Shohji, Takao Nakamura, Fuminari Mori and Shinichi Fujiuchi
    Materials Transactions, Vol.43, No.8, pp.1797-1801 (2002)
  • 無電解Ni/Auめっきパッドを用いたBGA接合部組織と強度に及ぼすはんだボール中のCuコアの影響
    佐伯敏男, 清野紳弥, 上西啓介, 小林紘二郎, 荘司郁夫, 山本雅春
    エレクトロニクス実装学会誌 4,[4], pp.306-311 (2001)
  • 熱サイクル負荷を受けるSn-Ag系Pbフリーはんだ接合部の破断寿命評価
    荘司郁夫, 森史成, 藤内伸一, 山下勝
    エレクトロニクス実装学会誌 4,[4], pp.289-292 (2001)
  • Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
    Ikuo Shohji, Fuminari Mori and Kojiro F. Kobayashi
    Materials Transactions, Vol.42, No.5,pp.790-793 (2001)
  • Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
    Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Kojiro F. Kobayashi, Ikuo Shohji, Masataka Nishiura and Masaharu
    Yamamoto
    Materials Transactions, Vol.42, No.5,pp.756-760 (2001)
  • CuコアSn-3.5Agはんだを用いたBGA接合部組織とせん断強度
    小原泰浩, 佐伯敏男, 上西啓介, 小林紘二郎, 荘司郁夫, 山本雅春
    エレクトロニクス実装学会誌 4,[3], pp.192-199 (2001)
  • Sn-Ag系Pbフリーはんだを用いたマイクロ接合部の熱疲労組織
    荘司郁夫, 森史成, 藤内伸一, 山下勝
    エレクトロニクス実装学会誌 4,[2], pp.133-137 (2001)
  • 高密度実装基板におけるフリップチップリワーク法
    森史成, 鳥山和重, 勝直樹, 荘司郁夫
    エレクトロニクス実装学会誌 3,[4], pp.335-338 (2000)
  • BGA接合部組織と強度に及ぼすはんだボール中のCuコアの影響
    清野紳弥, 上西啓介, 小林紘二郎, 荘司郁夫, 山本雅春
    エレクトロニクス実装学会誌 2,[4], pp.298-302 (1999)
  • AuとIn-Sn系はんだの界面における金属間化合物成長過程
    荘司郁夫, 藤原伸一, 清野紳弥, 藤井俊夫, 小林紘二郎
    エレクトロニクス実装学会誌 2,[2], pp.121-126 (1999)
  • Intermetallic Compound Layer Formation Between Au and In-48Sn Solder
    I.Shohji, S.Fujiwara, S.Kiyono and K.F.Kobayashi
    Scripta Materialia, Vol.40, No.7, pp.815-820 (1999)
  • Auバンプを用いたフリップチップ接合部の組織と熱疲労特性
    荘司郁夫, 折井靖光, 小林紘二郎
    溶接学会論文集, 第16集 第2号, pp.215-222 (1998)
  • フリップチップ接合用はんだ材のせん断特性
    荘司郁夫, 折井靖光, 小林紘二郎
    溶接学会論文集, 第16集 第1号, pp.51-58 (1998)
  • AuとIn-48Snはんだの界面における金属間化合物成長過程
    荘司郁夫, 藤原伸一, 清野紳弥, 小林紘二郎
    回路実装学会誌 13,[1], pp.24-29 (1998)
  • In系はんだによる狭ピッチフリップチップアタッチ接合技術
    荘司郁夫, 山田毅, 木村英夫, 藤内伸一, 折井靖光
    回路実装学会誌 12,[1], pp.25-28 (1997)