Effects of the Temperature History Following Nitriding Treatment on the
Phase Composition of the Formed Compound Layer
Katsushige Shimizu, Soichiro Nogami, Koji Abe and Ikuo Shohji
NETSU SHORI, Vol.64, Extra edition, pp.193-198 (2024)
Numerical Simulation of Low Pressure Carburizing Incorporating Part Geometry
Katsushige Shimizu, Satoru Habuka, Koji Abe and Ikuo Shohji
NETSU SHORI, Vol.64, Extra edition, pp.11-16 (2024)
An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers
Makoto Iioka, Wataru Kawanabe, Subaru Tsujimura, Tatsuya Kobayashi, Ikuo
Shohji
Polymers 2024, 16(2), 224,pp.1-21 (2024)
【DOI：https://doi.org/10.3390/polym16020224】
Application of Metal Sputtering Treatment to Cellulose Materials Used as
Co-Deposited Material for Electrolytic Nickel Composite Plating
飯岡諒, 川鍋渉, 小林竜也, 荘司郁夫
溶接学会論文集, 第41巻, 第4号, pp.337-347 (2023)
【DOI : https://doi.org/10.2207/qjjws.41.337】
Investigation of Deposition Conditions and Basic Properties of CNF Composite
Ni Plated Film by Electroless Plating Method
Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol.1106, pp.69-74 (2023)
【DOI : https://doi.org/10.4028/p-P8lGXG】
Effect of Special Plating Films on Galvanic Corrosion Behavior between
Metal and CFRTP
Tatsuya Kobayashi, Kei Shimizu, Ikuo Shohji
Materials Science Forum, Vol.1106, pp.63-68 (2023)
【DOI : https://doi.org/10.4028/p-BGa78M】
Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized
Cellulose Nanofiber Composited Nickel Electroplated Films
Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol.1106, pp.55-62 (2023)
【DOI: https://doi.org/10.4028/p-NlB9Zf】
Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive
Joints
Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji
Key Engineering Materials, Vol.967, pp.63-68 (2023)
【DOI : https://doi.org/10.4028/p-XZXg5O】
Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu
Solder Ball Joints
Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh
Key Engineering Materials, Vol.967, pp.43-49 (2023)
【DOI : https://doi.org/10.4028/p-AxJR0d】
Fabrication of High-Temperature Solder by Zn Plating Films Containing Al
Particles
Tatsuya Kobayashi, Yuki Abiko, Ikuo Shohji
Key Engineering Materials, Vol.967, pp.37-42 (2023)
【DOI : https://doi.org/10.4028/p-CzY5ta】
Effect of Plating Potential on Three-Dimensional Structural Plating Films
and their Adhesion to Epoxy Resin
Tatsuya Kobayashi, Thai Anh Pham, Ikuo Shohji
Key Engineering Materials, Vol.967, pp.31-36 (2023)
【DOI：https://doi.org/10.4028/p-4q5TMh】
Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers
Introducedwith Carboxy Groups as Co-Deposited Materials
Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji and Kota
Sakamoto
Surfaces, Vol.6, No.2, pp.164-178 (2023)
【DOI：https://doi.org/10.3390/surfaces6020012】
Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free
Solder
Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida, Dmitri
Golberg and Ikuo Shohji
Materials Transactions, Vol.63, No.8, pp.1112-1119 (2022)
【DOI:10.2320/matertrans.MT-MC2022010】
Microstructure and Thermal Cycle Reliability of SnAgCuInSb Solder Joint
Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Masaaki Sarayama, Makoto
Iioka and Ikuo Shohji
Materials Transactions, Vol.63, No.7, pp.1021-1027 (2022)
【DOI:10.2320/matertrans.MT-MC2022013】
Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding
Technique Using Citric Acid
Shinji Koyama, Ikuo Shohji and Takako Muraoka
Materials Transactions, Vol.63, No.7, pp.987-992 (2022)
【DOI:10.2320/matertrans.MT-MC2022014】
An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited
Ni Film by Electroplating
Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi
Materials Transactions, Vol.63, No.6, pp.821-828 (2022)
【DOI:10.2320/matertrans.MT-MC2022012】
Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid
Surface Modifications
Shinji Koyama, Ikuo Shohji and Takako Muraoka
Materials Transactions, Vol.63, No.6, pp.813-820 (2022)
【DOI:10.2320/matertrans.MT-MC2022007】
Formation of CuNi Alloy Plating Film for Improving Adhesion between Metal
and Resin
Tatsuya Kobayashi, Akifumi Kubo and Ikuo Shohji
Materials Transactions, Vol.63, No.6, pp.800-804 (2022)
【DOI:10.2320/matertrans.MT-MC2022002】
Investigation of Mechanical Properties of High Tg Epoxy Resin Material
Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI
スマートプロセス学会誌, Vol.10, No.6, pp.365-371 (2021)
Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization
of Deposits
Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito
Wake,
Hiroki Yamamoto, Yuichiro Kamakoshi
Journal of Electroanalytical Chemistry, 897, 115582 (2021)
【DOI: https://doi.org/10.1016/j.jelechem.2021.115582】
Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power
Equipment
Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada,
Hiromitsu Watanabe and
Yuichiro Kamakoshi
Materials, 14, 4237 (2021)
【DOI:https://doi.org/10.3390/ma14154237】
Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with
Electrodeposited Ni-Cr-P Alloy Coating
Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya
Ando, Junichiro Hirohashi, Tsunehito Wake,
Katsufumi Inoue and Hiroki Yamamoto
Materials, 14, 4216 (2021)
【DOI:https://doi.org/10.3390/ma14154216】
Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel
Joints Fabricated by Friction Stir Spot Welding
Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro
Kamakoshi
Materials, 14, 3877 (2021) 【DOI:https://doi.org/10.3390/ma14143877】
Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties
of Sn-Sb-Ag Lead-Free Solder
Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko
Watanabe
Materials, 14, 3799 (2021)
【DOI:https://doi.org/10.3390/ma14143799】
Effect of Si Concentration of a Brazing Precursor on the Bonding Strength
of Aluminum Foam Bonded via Foaming Bonding
Ryosuke Suzuki, Yoshihiko Hangai, Yusuke Asakawa, Ikuo Shohji, Hidetoshi
Fujii, Masaaki Matsubara
Material Transactions, Vol.62, No.8, pp.1210-125 (2021)
【DOI:https://doi.org/10.2320/matertrans.MT-M2020393】
Joining process of dissimilar materials using three-dimensional electrodeposited
Ni-Cu film
T. Kobayashi & I. Shohji
Materials and Manufacturing Processes (2021)
【DOI:10.1080/10426914.2021.1885708】
Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint
with Surface Treatment UsingElectrolyzed Water
Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai
Materials Science Forum, Vol. 1016, pp. 1466-1472 (2021)
Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy
Interface under High Temperature andHigh Humidity Aging
Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka
Materials Science Forum, Vol. 1016, pp. 1436-1442 (2021)
Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding
for Multi-Material Components
Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota
Materials Science Forum, Vol. 1016, pp. 774-779 (2021)
Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition
for joining dissimilar materials
Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol. 1016, pp. 738-743 (2021)
Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder
Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji
Materials Science Forum, Vol. 1016, pp. 553-560 (2021)
Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation
of Corrosion Behavior
Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi,
Tsunehito Wake, Susumu Arai,
Yuichiro Kamakoshi
Materials Science Forum, Vol. 1016, pp. 522-527 (2021)
Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free
Solder Alloys with Small Amount of Ni Using Miniature Size Specimens
Tatsuya Kobayashi, Ikuo Shohji
Metals 2019, Volume 9, Issue 12, 1348 (2019)
Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten
Lead-Free Solder
Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo
Shohji
Applied Sciences, 9(13), 2724 (2019)
Effect of Bi addition on Tensile Properties of Sn-Ag-Cu Solder at Low Temperature
Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji
Materials Transactions, Vol.60, No.6, pp.909-914 (2019)
Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its
Microstructure and Mechanical Properties
Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji
Materials Transactions, Vol.60, No.6, pp.888-894 (2019)
Bondability Investigations of Thermosonic Flip Chip Bonding using Ultrasonic
Vibration Perpendicular to the Interface
Taizo Tomioka, Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, Vol.12, E18-013,
7 pages (2019)
Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating
Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi,
Tsunehito Wake and Susumu Arai
Applied Sciences, 9(6),1094 (2019)
Finite Element Method Analysis of Densification Process of Sintered Steelfor
Automobile in Cold Forging
Y. Morokuma, Y. Kamakoshi, S.Nishida, I. Shohji
International Journal of Technology and Engineering Studies, Vol. 5, Issue
1, pp. 30-36 (2019)
A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed
Lead-Free Solder Joint
Yusuke Nakata, Motoki Kurasawa, Tomihito Hashimoto, Kenji Miki and Ikuo
Shohji
Materials Science Forum, Vol. 941, pp.2087-2092 (2018)
Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge
Lead-Free Solder
Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.2081-2086 (2018)
Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In
Solder
Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata
Materials Science Forum, Vol. 941, pp.2075-2080 (2018)
Investigation of Crack Initiation in Glass Substrate by Residual Stress
Analysis
Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura
Materials Science Forum, Vol. 941, pp.2069-2074 (2018)
Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging
Process
Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, Tatsuya
Kobayashi and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.552-557 (2018)
Microstructures and Mechanical Properties of Welded Joints of Several High
Tensile Strength Steel
Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga
Materials Science Forum, Vol. 941, pp.224-229 (2018)
Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties
Using Miniature Size Specimens
Tatsuya Kobayashi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
Advances in Materials Science and Engineering, Volume 2018, Article ID
1416942 (2018)
Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of
Sn-5Sb and Sn-10Sb Solder Joints
Tatsuya Kobayashi, Ikuo Shohji, and Yusuke Nakata
Advances in Materials Science and Engineering, Volume 2018, Article ID
4829508 (2018)
Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties
of Miniature Size Specimens
Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo
Shohji
Solid State Phenomena, Vol. 273, pp.83-90 (2018)
Formation mechanism of pillar-shaped intermetallic compounds dispersed
lead-free solder joint
Y Nakata, T Hashimoto, M Kurasawa, Y Hayashi, and I Shohji
IOP Conf. Series: Materials Science and Engineering 257 (2017) 012014
Finite element method analysis of cold forging for deformation and densification
of Mo alloyed sintered steel
Y Kamakoshi, S Nishida, K Kanbe and I Shohji
IOP Conf. Series: Materials Science and Engineering 257 (2017) 012012
Improvement of mechanical strength of sintered Mo alloyed steel by optimization
of sintering and cold-forging processes with densification
Y Kamakoshi, I Shohji, Y Inoue and S Fukuda
IOP Conf. Series: Materials Science and Engineering 257 (2017) 012011
The effect of boriding on wear resistance of cold work tool steel
Y. Anzawa, S. Koyama and I. Shohji
Journal of Physics: Conf. Series 843 (2017) 012064
Liquid phase diffusion bonding of A1070 by using metal formate coated Zn
sheet
K. Ozawa, S. Koyama and I. Shohji
Journal of Physics: Conf. Series 843 (2017) 012005
Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper
Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani,
Yukio Inoue
Procedia Engineering 184, pp.743–749 (2017)
Change of Crystallographic Orientation Characteristics of (001)-Oriented
Electrodeposited Silver Films during Self-Annealing at Room Temperature
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Procedia Engineering 184, pp.725–731 (2017)
Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper
under Aging at High Temperature
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Procedia Engineering 184, pp.648–654 (2017)
Liquid Phase Diffusion Bonding of AC2C/ADC12 Aluminum Casting Alloy by
Using Metal Salt Coated Zn Sheet
Shunya Saijo, Shinji Koyama, Ikuo Shohji
Procedia Engineering 184, pp.284-289 (2017)
Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions
Kyosuke Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Procedia Engineering 184, pp.238–245 (2017)
Degradation Behaviors of Adhesion Strength of Structural Adhesive for Weld-Bonding
under High Temperatureand Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
Procedia Engineering 184, pp.231–237 (2017)
Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints
Dispersed Pillar Shaped IMCs
Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomihito Hashimoto
Procedia Engineering 184, pp.214–222 (2017)
Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free
Solder
Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono
Materials Science Forum, Vol. 879, pp.2377-2382 (2016)
Comparison of Self-Annealing Behaviors in (001)- and (111)-Oriented Electrodeposited
Silver Films by In Situ EBSP Analysis
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Materials Science Forum, Vol. 879, pp.2243-2248 (2016)
Effect of Added Elements on Microstructures and Joint Strength ofLead-free Sn-Based Solder Joint Dispersed IMC Pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto
Materials Science Forum, Vol. 879, pp.2216-2221 (2016)
Microstructure and electrochemical corrosion behavior of Fe-Cr system alloys
as substitutes for Ni-based brazing filler metal
K.D. Shi, T. Tsunoda, I. Shohji, K. Matsu and Y. Taguchi
Acta Metallurgica Sinica(English Letters), 29-8, pp.697-706 (2016)
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization
Hanae Hata, Yuuki Maruya and Ikuo Shohji
Materials Transactions, Vol. 57, No. 6, pp.887-891 (2016)
Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based
Lead-Free Solder
Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
Materials Transactions, Vol. 57, No. 6, pp.873-880 (2016)
In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited
Silver Film by EBSD Method
Yumi Hayashi, Hiroshi Miyazawa, Kohei Minamitani and Ikuo Shohji
Materials Transactions, Vol. 57, No. 6, pp.815-818 (2016)
Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion
Bonded Sn/Sn with Bi Filler
Shinji Koyama, Issei Oya and Ikuo Shohji
Materials Transactions, Vol. 57, No. 6, pp.810-814 (2016)
Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability
of the Solder Joint
Hanae Shimokawa, Tasao Soga, Koji Serizawa, Kaoru Katayama and Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, Vol. 8, No.
1, pp.46-54 (2015)
Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed
with Fe-Cr System Alloy
Kangdao Shi, Takahiro Tsunoda, Kazuomi Kusumoto, Ikuo Shohji, Kotaro Matsu
and Yasuhiro Taguchi
Journal of Smart Processing - for Materials, Environment & Energy -,
Vol. 4, No. 4, pp.215-221 (2015)
Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Organic
Acid and Its Persistence of Reformed Layer
Shinji Koyama, Naoki Hagiwara and Ikuo Shohji
Japanese Journal of Applied Physics, vol. 54, pp.030216-1-030216-4 (2015)
Effect of Filler Content and Coupling Agent on Mechanical Properties of
Underfill Material
Hironao Mitsugi, Shinya Kitagoh, Ikuo Shohji and Shinji Koyama
Transactions of the Japan Institute of Electronics Packaging, Vol. 7,
pp.25-31 (2014)
Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding
Technique with Acetic Acid
Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda and Ikuo Shohji
Advanced Materials Research, Vol. 922, pp.491-496 (2014)
Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with
Formic Acid and Citric Acid
Naoki Hagiwara, Shinji Koyama and Ikuo Shohji
Advanced Materials Research, Vol. 922, pp.219-223 (2014）
Effect of Strain Rate on Tensile Properties of Miniature Size Specimens
of Several Lead-free Alloys
Ikuo Shohji and Yuichiro Toyama
Materials Science Forum, Vol. 783-786, pp.2810-2815 (2014)
Effect of Se content in high-cyanide silver plating solution on {200} crystal
plane orientation ratio of electrodeposited silver layer
Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and
Ikuo Shohji
Materials Science Forum, Vol. 783-786, pp.1458-1463 (2014)
A Study of the Effect of Indium Filler Metal on the Bonding Strength of
Copper and Tin
Shinji Koyama, Seng Keat Ting, Yukinari Aoki and Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, 6(1), pp.93-98
(2013)
Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength
of Solid-State Bonded Interface of Al
Shinji Koyama, Ting Seng Keat, Shun Amari, Kouta Matsubara and Ikuo Shohji
Materials Transactions, 54, No. 10, pp.1975-1980 (2013)
Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating
against Lead-free Solder
J. Watanabe, N. Sekimori, K. Hatsuzawa, T. Uetani and I. Shohji
Journal of Physics: Conference Series, 379 (2012) 012025
Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization
and Sn-3Ag-0.5Cu Solder Ball
Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
Key Engineering Materials, 462-463, pp.849-854 (2011)
Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni addition
Hirohiko Watanabe, Masayoshi Shimoda, Noboru Hidaka and Ikuo Shohji
Key Engineering Materials, 462-463, pp.247-252 (2011)
Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge
Alloy
Ikuo Shohji, Ryohei Arai, Hisao Ishikawa and Masao Kojima
Key Engineering Materials, 462-463, pp.82-87 (2011)
Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue
Life for Chip Size Package Solder Joints
Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
Key Engineering Materials, 462-463, pp.76-81 (2011)
Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge
Alloy
Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa and Ikuo Shohji
Key Engineering Materials, 462-463, pp.70-75 (2011)
Cu-Sn-Zr-P Alloy for High-Strength Heat Exchanger Tube
Tetsuya Ando, Hirokazu Tamagawa and Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, 3, pp.14-17
(2010)
Effect of Formic Acid Surface Modification on Bond Strength of Solid-State
bonded Interface of Tin and Copper
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Materials Transactions, 51, No.10, pp.1759-1763 (2010)
Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-free
Sn-Cu Foil
Ikuo Shohji, Shinji Koyama, Itaru Oshiro, Hideaki Nara and Yoshiharu Iwata
Materials Transactions, 51, No.10, pp.1753-1758 (2010)
Boron Particle Composite Plating with Ni-B Alloy Matrix
Susumu Arai, S Kasai and Ikuo Shohji
Journal of The Electrochemical Society, 157, pp.D119-D125 (2010)
Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten
Sn-3Ag-0.5Cu Solder
Ikuo Shohji, Kazuhito Sumiyoshi and Makoto Miyazaki
Transactions of the Japan Institute of Electronics Packaging, 2, pp.35-39
(2009)
Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb
Solder for Aerospace Application
Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara
and Fusao Iwase
Transactions of the Japan Institute of Electronics Packaging, 2, pp.29-34
(2009)
Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
Journal of The Electrochemical Society, 156, pp.D283-D286 (2009)
Effect of Shear Speed on Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball
Joint
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Transactions of the Japan Institute of Electronics Packaging, 1, pp.9-14
(2008)
Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size
Package Solder Joint
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi
Ogawa and Takayuki Kawano
Key Engineering Materials, Vol.385-387, pp.433-436 (2008)
Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder
Ball Joints
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Key Engineering Materials, Vol.385-387, pp.429-432 (2008)
Impact Properties of Lead-free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
Ikuo Shohji, Hirohiko Watanabe, Takeshi Okashita and Tsutomu Osawa
Materials Transactions, Vol.49, No.7, pp.1513-1517 (2008)
Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing
Phosphorous Particles
Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
Journal of The Surface Finishing Society of Japan, Vol.59, No.5, pp.343-345
(2008)
Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu
Lead-Free Solders Using Strain Rate Sensitivity Index
Kiyokazu Yasuda, Ikuo Shohji and Tadashi Takemoto
Materials Science Forum, Vol.580-582, pp.221-224 (2008)
Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-free
Solders
Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu
Yasuda and Tadashi Takemoto
Materials Transactions, Vol.49, No.5, pp.1175-1179 (2008)
Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package
Solder Joints
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi
Ogawa and Takayuki Kawano
Smart Processing Technology, Vol.2, pp.111-114 (2008)
Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn
Solder Joints on Electroless Ni/Au Plated Electrodes
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Smart Processing Technology, Vol.2, pp.103-106 (2008)
Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders
Evaluated by Micro Size Specimens
Ikuo Shohji, Tsutomo Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu
Yasuda and Tadashi Takemoto
Smart Processing Technology, Vol.2, pp.99-102 (2008)
Influence of Content of Ni and Ag on Microstructure and Joint Strength
of Sn-Ag-Cu-Ni-Ge Lead-Free Solder Joint
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe and Tatsuhiko Asai
Key Engineering Materials, Vol.353-358, pp.2033-2036 (2007)
Effect of Properties of Underfill Materials on Thermal Stress Relief in
Lead-Free Solder Joint of Chip Size Package
Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano
Key Engineering Materials, Vol.353-358, pp.2029-2032 (2007)
Development of Cu Brazing Sheet with Cu-P Composite Plating
Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo and Masahisa Uenishi
Key Engineering Materials, Vol.353-358, pp.2025-2028 (2007)
An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-free
Solder Using Surface Deformation
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Key Engineering Materials, Vol.326-328, pp.1035-1038 (2006)
Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu
Lead-free Solder
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Key Engineering Materials, Vol.306-308, pp.115-120 (2006)
Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-free Alloy under Heat
Exposure Conditions
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe, Tatsuhiko Asai and Megumi
Nagano
Materials Transactions, Vol.46, No.12, pp.2737-2744 (2005)
Comaprison of Immersion Gold Plating in Reliability of a Lead-free Solder
Joint with Autocatalytic Electroless Gold Plating
Kiyotomo Nakamura, Toshikazu Ookubo, Ikuo Shohji and Hiroki Goto
Materials Transactions, Vol.46, No.12, pp.2730-2736 (2005)
Influence of an Immersion Gold Plating Layer on Reliability of a Lead-free
Solder Joint
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Materials Transactions, Vol.46, No.12, pp.2725-2729 (2005)
Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu
solders
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Materials Transactions, Vol.46, No.11, pp.2335-2343 (2005)
Estimation of Thermal Fatigue resistances of Sn-Ag and Sn-Ag-Cu Lead-free
Solders using Strain Rate Sensitivity Index
Ikuo Shohji, Kiyokazu Yasuda and Tadashi Takemoto
Materials Transactions, Vol.46, No.11, pp.2329-2334 (2005)
Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure
of Solder Joint with Sn-3Ag-0.5Cu
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Key Engineering Materials, Vol.297-300, pp.2864-2869 (2005)
High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic
Bonding for High-Frequency Chip Coil
Ikuo Shohji, Tsukasa Sakurai and Shinji Arai
Key Engineering Materials, Vol.297-300, pp.2819-2824 (2005)
Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base
Filler Metals Added Cr Powder
Ikuo Shohji, Satoshi Takayama, Takanori Nakazawa, Ken Matsumoto and Masanori
Hikita
Key Engineering Materials, Vol.297-300, pp.2767-2771 (2005)
Tensile Properties of Sn-0.7mass%Cu Lead-free Solder
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Transactions of Materials Research Society of Japan, Volume 29 - No.5,
pp.2001-2004 (2004)
Creep Properties of Sn-8mass%Zn-3mass%Bi Lead-free Alloy
Ikuo Shohji, Colin Gagg and William J. Plumbridge
Journal of Electronic Materials, Vol. 33, No.8, pp.923-927 (2004)
Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free
Solder Balls
Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira
Ichida
Materials Transactions, Vol.45, No.3,pp.754-758 (2004)
Comparison of Low-melting Lead-free Solders in Tensile Properties with
Sn-Pb Eutectic Solder
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Journal of Materials Science: Materials in Electronics, 15-4, pp.219-223
(2004)
Solder Joint Reliability Evaluation of Chip Scale Package using a Modified
Coffin-Manson Equation
Ikuo Shohji, Hideo Mori and Yasumitsu Orii
Microelectronics Reliability, 44, pp.269-274 (2004)
Tensile Properties of Sn-Ag Based Lead-free Solders and Strain Rate Sensitivity
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Materials Science and Engineering A, Vol. 366-1, pp.50-55 (2004)
Microstructures and Hardness of Mo Heater Chip Brazed with Au-18mass%Ni
Ikuo Shohji, Yoshinori Kawabata and Yoshitaka Kimura
Materials Transactions, Vol.44, No.5, pp.866-869 (2003)
Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
Ikuo Shohji, Fuminari Mori and Kojiro F. Kobayashi
Materials Transactions, Vol.42, No.5,pp.790-793 (2001)
Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints
with Au/Ni Coated Cu Pads
Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Kojiro F. Kobayashi, Ikuo
Shohji, Masataka Nishiura and Masaharu
Yamamoto
Materials Transactions, Vol.42, No.5,pp.756-760 (2001)
Intermetallic Compound Layer Formation Between Au and In-48Sn Solder
I.Shohji, S.Fujiwara, S.Kiyono and K.F.Kobayashi
Scripta Materialia, Vol.40, No.7, pp.815-820 (1999)