金属材とCFRTP間のガルバニック腐食を抑制する特殊めっき膜の特性評価
清水憩, 荘司郁夫, 小林竜也
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.360-361
(2024), 横浜
パワー半導体向け焼結材料の機械的特性評価方法の開発
林和, 荘司郁夫, 小林竜也, 三ツ木寛尚
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.338-339
(2024), 横浜
ビスフェノールF型エポキシ樹脂/Al接着界面の劣化挙動に及ぼす高温高湿時効の影響
渡部樹, 小林竜也, 荘司郁夫
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.315-319
(2024), 横浜
複合めっき法によるAl粒子含有Znめっきの創製と評価
安彦祐輝, 荘司郁夫, 小林竜也
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.336-337
(2024), 横浜
エポキシ樹脂と接着性控除鵜に向けた三次元めっき膜生成条件の影響評価
PHAM THAI ANH, 荘司郁夫, 小林竜也
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.334-335
(2024), 横浜
TEMPO酸化CNFを複合材とした無電解Ni複合めっき膜の成膜および特性調査
川鍋渉, 飯岡諒, 小林竜也, 荘司郁夫
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.324-327
(2024), 横浜
高温高湿環境下における鋼/Al合金接着継手強度に及ぼすアミノ基含有シラン系処理の影響
片山太郎, 小坂豪志, 小林竜也, 荘司郁夫
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.308-312
(2024), 横浜
Al含有フェライト系ステンレス鋼のCu-Mn-Niろうによるろう付
塚越皓也, 小林竜也, 荘司郁夫, 広橋順一郎, 井上勝文, 和氣庸人
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.229-233
(2024), 横浜
プリンテッドエレクトロニクス用電極とSn-57.6Bi-0.4Ag低融点はんだの界面反応
小山真里奈, 小林竜也, 荘司郁夫, 坂井修大, 藤井香織, 佐々木柾之
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.194-199
(2024), 横浜
アルミニウム粒子を用いた次世代パワー半導体実装用接合材の創製
後藤梨花, 荘司郁夫, 小林竜也
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.92-93
(2024), 横浜
Sn-Sb-Ag-Ni-Ge系はんだ合金の疲労特性およびミクロ組織に与えるAg添加量の影響
川井健太郎, 小林竜也, 荘司郁夫, 三ツ井恒平, 渡邉裕彦
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.44-48
(2024), 横浜
フリップチップ用低温鉛フリーはんだの機械的特性調査
梅田翔太, 小林竜也, 荘司郁夫, 乃万裕一, 平野寿枝, 小野関仁, 加藤禎明
Mate2024(Microjoining and Assembly Technology in Electronics) Proc., pp.24-28
(2024), 横浜
Effect of HIgh Temperature and Humidity on Bond Strength of Al/Resin Adhesive
Joints
Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji
Abstract Book of THERMEC'2023, 1049, pp.597-598 (2023), VIENNA
Effect of Special Plating Films on Galvanic Corrosion Behavior between
Metal and CFRTP
Kei Shimizu, Ikuo Shohji, Tatsuya Kobayashi
Abstract Book of THERMEC'2023, 909, pp.524-525 (2023), VIENNA
Effect of Plating Potential on Three-Dimensional Structural Plating Films and
Their Adhesion to Epoxy Resin
Thai Anh Pham, Ikuo Shohji, Tatsuya Kobayashi
Abstract Book of THERMEC'2023, 799, pp.464-465 (2023), VIENNA
Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu
Solder Ball Joints
Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh
Abstract Book of THERMEC'2023, 771, pp.445 (2023), VIENNA
Microstructure and Mechanical Properties ofA6061/GA980 Resistance Spot Weld
Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi
Iyota
Abstract Book of THERMEC'2023, 736, pp.430 (2023), VIENNA
Investigation of deposition conditions and basic properties of CNF composite
Ni plated film by electroless plating method
Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji
Abstract Book of THERMEC'2023, 490, pp.300 (2023), VIENNA
Investigation of Effects of Electroplating Conditions on Morphology of
TEMPO Oxidized Cellulose Nanofiber Composited Nickel Films
Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji
Abstract Book of THERMEC'2023, 423, pp.263-264 (2023), VIENNA
Fabrication of High-Temperature Solder by Zn Plating Films Containing Al
Particles Yuki Abiko, Ikuo Shohji, Tatsuya Kobayashi
Abstract Book of THERMEC'2023, 10, pp.88-89 (2023), VIENNA
Al/エポキシ樹脂接着部の高温高湿環境下における劣化挙動
渡部樹, 荘司郁夫, 小林竜也
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.277-278
(2023), 横浜
高温高湿環境下における鋼/Al 合金接着剤継手強度に及ぼすTi 系化成処理の影響
小坂豪志, 荘司郁夫, 小林竜也
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.271-276
(2023), 横浜
無電解法によるニッケルめっき膜へのセルロースナノファイバー複合化手法の検討
川鍋渉, 飯岡諒, 荘司郁夫, 小林竜也
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.179-180
(2023), 横浜
複合めっき法による Zn-Al 系はんだめっきの作製と特性評価
安彦祐輝, 荘司郁夫, 小林竜也
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.177-178
(2023), 横浜
Al 粒子を用いた液相焼結型接合材の開発
小林竜也, 荘司郁夫
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.175-176
(2023), 横浜
特殊めっき膜を用いた金属-CFRTP 接合におけるガルバニック腐食の抑制評価
清水憩, 荘司郁夫, 小林竜也
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.171-174
(2023), 横浜
三次元構造めっき膜の電気化学的挙動とその応用
PHAM THAI ANH, 荘司郁夫, 小林竜也
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.167-170
(2023), 横浜
Sn-3.0Ag-0.5Cu はんだボール接合部のミクロ組織およびせん断強度に及ぼす Sb 添加の影響
小山真里奈, 荘司郁夫, 小林竜也, モハド・アリフ・アヌアル・モハド・サレー
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.152-157
(2023), 横浜
Sn-58Bi はんだとの界面反応抑制効果を有するプローブ材の開発
渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小谷直仁, 小林俊介
Mate2023(Microjoining and Assembly Technology in Electronics) Proc., pp.146-151
(2023), 横浜
Deteriorated Characteristics on the Fatigue Strength of Dissimilar A6061/Galvannealed
Steel Joints Fabricatedby Friction Stir Spot Welding
A. Toshimitsu Yokobori, Jr, Toshihito Ohmi, Go Ozeki, Ikuo Shohji, Tsutomu
Katsumata and Toru Matsubara
Proc. of IIW2022 - International Conference on Welding and Joining, pp.309-311
(2022), Tokyo
Joining Dissimilar Materials Using Three- Dimensional Electrodeposited
Film
T. Kobayashi, K. Yamazaki, I. Shohji
ICEP2022 Proceedings, P06, pp.219-220 (2022), Sapporo
Development of Sn Solder Plating Containing Cellulose Nanofiber
T. Kobayashi, A. Kogure, I. Shohji
ICEP2022 Proceedings, P05, pp.217-218 (2022), Sapporo
Formation of Specially Shaped Plating Film by Nickel–Copper Alloy Electrodeposition
T. Kobayashi, A. Kubo, I. Shohji
ICEP2022 Proceedings, P04, pp.215-216 (2022), Sapporo
Effect of Wetting Agent on Morphology of Cellulose Nano-Fiber Composited
Nickel Electroless Plating Film
M. Iioka, W. Kawanabe, I. Shohji, T. Kobayashi
ICEP2022 Proceedings, FD3-2, pp.181-182 (2022), Sapporo
Effect of High Temperature and High Humidity Enviromment on Adhesion Strength
of High Tg Epoxy Resin and Copper Joint
X. Zhao, H. Mitsugi, I. Shohji, T. Kobayashi
ICEP2022 Proceedings, WE1-1, pp.29-30 (2022), Sapporo
スズ-セルロースナノファイバー複合めっきによる鉛フリーはんだの創製
木暮明勇輝, 荘司郁夫, 小林竜也
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.257-258
(2022)
特殊形状めっき膜を用いた高撥水化技術の開発
久保瑛史, 荘司郁夫, 小林竜也
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.249-252
(2022)
パワー半導体用Sn-Sb-Ag系はんだ接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響
山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.157-162
(2022)
高温環境下でのSn-Sb-Ag-Ni-Ge系はんだ合金の機械的特性および疲労劣化挙動
山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.137-142
(2022)
Ni-P-Cr合金めっき膜を用いたSUS304鋼のろう付
松尾祐哉, 劉澍彬, 荘司郁夫, 小林竜也, 広橋順一郎, 和氣庸人, 山本巨紀
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.116-119
(2022)
Sn-Sb-Ag系鉛フリーはんだ接合部のボールせん断強度に及ぼす添加元素の影響
赤石瑞季, 小山真里奈, 山本瑞貴, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.101-102
(2022)
Pd-Cu-Ag-Zn合金/Sn-58Biはんだ界面における反応層成長挙動
渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.94-98
(2022)
Effect of Aging Time on Strength of High Tg Epoxy Resin for Electronic
Packaging and Its Joint with Copper
Xinya ZHAO, Hironao MITSUGI, Ikuo Shohji, and Tatsuya Kobayashi
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.76-77
(2022)
特殊形状めっき膜を用いた金属/CFRTPの接合特性
山﨑康平, 荘司郁夫, 小林竜也
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.50-53
(2022)
無電解めっき法によるセルロースナノファイバー含有ニッケル複合めっき成膜の検討
飯岡諒, 川鍋渉, 荘司郁夫, 小林竜也
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.46-47
(2022)
EBSD 法による電力機器用無酸素銅の低サイクル疲労損傷挙動調査
椙岡桐吾, 田中拓真, 荘司郁夫, 小林竜也, 嶋田祐也, 渡辺広光
Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., pp.13-16
(2022)
セルロースナノファイバ含有ニッケル電解複合めっきの共析機構に関する初期的考察
飯岡諒, 荘司郁夫, 小林竜也
MES 2021 (第31回マイクロエレクトロニクスシンポジウム)論文集, pp.275-278 (2021)
Accuracy Assessment of Quantification Method of Cellulose Nano-Fiber in
Nickel Plating Film Using Image Analysis
Makoto Iioka, Ikuo Shohji, Tatsuya Kobayashi
ICEP 2021 Proceedings, P07,pp.177-178 (2021)
Sn-Sb-Ag系高温鉛フリーはんだのミクロ組織および疲労特性に及ぼす添加元素の影響
山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.308-313
(2021）
パワー半導体用Sn-Sb-Ag系はんだ接合部のパワーサイクル損傷挙動
山中佑太, 荘司郁夫, 小林竜也, 渡邉裕彦
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.304-305
(2021)
セルロースナノファイバー含有ニッケル複合めっき成膜条件の基礎研究
飯岡諒, 荘司郁夫, 小林竜也
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.290-291
(2021）
電解めっきを用いたNiろう被膜の創製
Liu Shubin, 荘司郁夫, 小林竜也, 広橋純一郎, 和気庸人, 鎌腰雄一郎
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.276-277
(2021）
A6061/亜鉛メッキ鋼板摩擦撹拌点接合部の疲労特性
熊本光希, 荘司郁夫, 小林竜也
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.272-275
(2021）
マルチマテリアル用Fe/Alレーザ溶接部のミクロ組織と機械的特性
中山耕作, 荘司郁夫, 小林竜也, 松永達則
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.246-249
(2021）
ビスフェノールＦ型エポキシ樹脂/はんだ接着界面の強度評価
三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也
Mate 2021(Microjoining and Assembly Technology in Electronics) Proc., pp.127-128
(2021）
Fe/Al異材マイクロ接合部の接合強度に及ぼす金属間化合物層の影響
熊本光希, 荘司郁夫, 小林竜也, 伊與田宗慶
Mate 2020 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.293-296 (2020), 横浜
電析Ni-P非晶質合金被膜を利用したステンレス鋼の接合
橋本晏奈, 荘司郁夫, 小林竜也, 劉澍彬, 広瀬順一郎, 和氣庸人, 鎌腰雄一郎
Mate 2020 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.273-276 (2020), 横浜
Alの固相拡散接合に及ぼす電解水水溶液による表面処理の影響
田中拓真, 荘司郁夫, 小林竜也, 今井久司
Mate 2020 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.265-268 (2020), 横浜
Sn-Sb-Ag系合金の高温疲労特性に及ぼすNiおよびGe添加の影響
三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦
Mate 2020(Microjoining and Assembly Technology in Electronics) Proc., pp.187-192
(2020), 横浜
ビスフェノールF型エポキシ樹脂/銅接着界面の劣化寿命に及ぼす時効条件の影響
鈴木陸, 荘司郁夫, 小林竜也, 戸野塚悠
Mate 2020 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.143-146 (2020), 横浜
Degradation Mechanism of Structural Adhesive under High Temperature and
High Humidity Conditions
Hitomi ABIKO, Kosaku NAKAYAMA, Tatsuya KOBAYASHI, Ikuo SHOHJI, Yugo TOMITA,
Tatsunori MATSUNAGA
Proc. of Visual-JW2019 & WSE 2019, PT-34, pp.231-232 (2019), Osaka
Investigation of Corrosion Resistance of Nickel-based Brazing Filler Metal
for Stainless Steel by Electrochemical Measurement
Yusuke FUKAI, Tatsuya KOBAYASHI, Ikuo SHOHJI, Tetsuya ANDO, Takuya YOSHIDA,
Tsuyoshi KASHIWASE,
Noboru OTOMO
Proc. of Visual-JW2019 & WSE 2019, PT-41, pp.245-246 (2019), Osaka
Investigation of High Temperature Fatigue Properties and Microstructures
of Sn-Sb-Ag alloys
Kohei MITSUI, Tatsuya KOBAYASHI, Ikuo SHOHJI, Hirohiko WATANABE
Proc. of Visual-JW2019 & WSE 2019, PT-42, pp.247-248 (2019), Osaka
熱交換器用Niろうの電気化学測定による腐食挙動調査
深井祐佑, 荘司郁夫, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇
Mate 2019 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.375-378 (2019), 横浜
Sn-５SbおよびSn-Sb-Ag三元共晶合金の高温疲労特性
三ツ井恒平, 荘司郁夫
Mate 2019 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.327-332 (2019), 横浜
Sn-Sb-Ni系高温用鉛フリーはんだの微細組織及び機械的特性
小林竜也, 三ツ井恒平, 荘司郁夫
Mate 2019 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.321-326 (2019), 横浜
構造用接着剤の接着強度の劣化に及ぼす高温高湿環境の影響
安孫子瞳, 荘司郁夫, 清水誠吾, 冨田雄吾
Mate 2019 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.213-216 (2019), 横浜
Finite Element Method Analysis of Densification Process of Sintered Steel
for Automobile in Cold Forging
Y. Morokuma, Y. Kamakoshi, S.Nishida, I. Shohji
ATE-2018 Conference Abstract Proceeding DVD (AEEIT-2019), 14 (2019), Bangkok
Residual Stress Analysis in Glass Substrate for Electronic Packaging byFinite
Element Method
A. Shinohara, I. Shohji, and Y. Umemura
Final Program & Abstract Book of 4th International Conference on Nanojoining
and Microjoining 2018 (NMJ2018) ,
P32 (2018), Nara
Micro-brazing of Stainless Steel using Ni-P Alloy Plating
Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi,Tsunehito
Wake and Susumu Arai
Final Program & Abstract Book of 4th International Conference on Nanojoining
and Microjoining 2018 (NMJ2018) ,
P31 (2018), Nara
Erosion Resistance Properties of Iron-carbon Composite Plating to MoltenLead-free
Solder
J. Watanabe, K. Hatsuzawa, S. Ogata, S. Yoshida, and I. Shohji
Final Program & Abstract Book of 4th International Conference on Nanojoining
and Microjoining 2018 (NMJ2018) ,
P21 (2018), Nara
Effect of Ni Addition on Tensile and Fatigue Properties of Sn-Sb Alloy
T. Kobayashi, K. Mitsui, and I. Shohji
Final Program & Abstract Book of 4th International Conference on Nanojoiningand
Microjoining 2018 (NMJ2018) ,
P16 (2018), Nara
Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder
Masaki Yokoi, Kobayashi Tatsuya, Shohji Ikuo
Book of abstracts of THERMEC'2018, 1548, pp.1045 (2018), Paris, France
Investigation of Crack initiation in Glass Substrate by Residual Stress
analysis
Amon Shinohara, Kobayashi Tatsuya, Shohji Ikuo, Umemura Yuki
Book of abstracts of THERMEC'2018, 1519, pp.1028 (2018), Paris, France
A Study on Reliability of Pillar-Shaped intermetallic Compounds Dispersed
Lead-Free Solder Joint
Yusuke Nakata, Kurasawa Motoki, Hashimoto Tomihito, Miki Kenji, Shohji
Ikuo
Book of abstracts of THERMEC'2018, 1492, pp.1012 (2018), Paris, France
Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging
Process
Yuki Morokuma, Nishida Shinichi, Kamakoshi Yuichiro, Kanbe Koshi, Kobayashi
Tatsuya, Shohji Ikuo
Book of abstracts of THERMEC'2018, 1487, pp.1009 (2018), Paris, France
Effect of Cooling Rate on intermetallic Compounds Formation in Sn-Ag-Cu-In
Solder
Kenji Miki, Kobayashi Tatsuya, Shohji Ikuo, Nakata Yusuke
Book of abstracts of THERMEC'2018, 1479, pp.1004 (2018), Paris, France
Microstructure and Mechanical Properties of Welded Joints of Several High
Tensile Strength Steel
Takahiro Izumi, Kobayashi Tatsuya, Shohji Ikuo, Miyanaga Hiroaki
Book of abstracts of THERMEC'2018, 1445, pp.984-985 (2018), Paris, France
有限要素法による多孔質材料の大変形シミュレーション
諸隈湧気, 鎌腰雄一郎, 西田進一, 荘司郁夫
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.257-260 (2018), 横浜
有限要素解析によるガラス基板のき裂発生メカニズムの調査
篠原亜門, 荘司郁夫, 梅村優樹
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.221-224 (2018), 横浜
高温高湿試験による銅/エポキシ樹脂接着界面の寿命評価
戸野塚悠, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.109-114 (2018), 横浜
Sn-Ag-Cu-Ni-Ge微小試験片の引張特性および疲労特性に及ぼす温度の影響
横井雅輝, 荘司郁夫
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.75-78 (2018), 横浜
Sn-57Bi-1Ag 鉛フリーはんだを用いた低温接合に及ぼすAg 電極材の影響
丸屋優樹, 秦英恵, 荘司郁夫
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.61-64 (2018), 横浜
ピラー状金属間化合物分散鉛フリーはんだ接合部の信頼性に関する検討
中田裕輔, 林和, 倉澤元樹, 橋本富仁, 三木健司, 荘司郁夫
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.21-24 (2018), 横浜
ピラー状金属間化合物分散鉛フリーはんだ接合部生成に及ぼす冷却速度の影響
三木健司, 荘司郁夫, 中田裕輔, 林和
Mate 2018 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.17-20 (2018), 横浜
Comparison between Sn-Sb and Sn-Ag-Cu-Ni-Ge alloys in Tensile Properties
Using Miniature Size Specimen
Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, Ikuo
Shohji
The Electronic Packaging Interconnect Technology Symposium (EPITS 2017)
Conference Program Book, pp.24 (2017), Fukuoka
Novel Development of Lead-free Solder and Their Mechanical Properties(invited)
Ikuo Shohji
The Electronic Packaging Interconnect Technology Symposium (EPITS 2017)
Conference Program Book, pp.11 (2017), Fukuoka
Change in Chemical Structure of Structural Adhesive under High Temperature
and Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
Program of InterPACK2017, pp.64 (2017), San Francisco, CA, USA
Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene
Glycol with Rust Inhibitor
Kazunari Higuchi, Ikuo Shohji, Shinji Koyama, Tetsuya Ando, Yoshikazu Mizutani,
Yukio Inoue
Program of InterPACK2017, pp.64 (2017), San Francisco, CA, USA
Effect of Surface Finish of Cu Electrode on Characteristics of High Melting
Point Joint Using Sn-57Bi-1Ag
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
Program of InterPACK2017, pp.63 (2017), San Francisco, CA, USA
Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its
Degradation Mechanism under Aging
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Program of InterPACK2017, pp.62 (2017), San Francisco, CA, USA
Improvement of Mechanical Strength of Sintered Mo Alloyed Steel by Optimization
of Sintering and Cold-ForgingProcesses with Densificatiom
Y Kamakoshi, I Shohji, Y Inoue, S Fukuda
ICMER2017 Proceedings, IC011, pp.13-14(2017), Pahang, Malaysia
Finite Element Method Analysis of Cold-forging For Deformation and Densification
of Mo alloyed Sintered Steel
Y Kamakoshi, S Nishida, K Kanbe, I Shohji
ICMER2017 Proceedings, IC012, pp.15(2017), Pahang, Malaysia
Formation Mechanism of Pillar-Shaped Intermetallic Compounds Dispersed
Lead-Free Solder Joint
Y Nakata, T Hashimoto, M Kurasawa, Y Hayashi, I Shohji
ICMER2017 Proceedings, IC014, pp.18(2017), Pahang, Malaysia
Effect of Aging and Test Temperature on Adhesion Strength of Copper and
Epoxy Resin
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ICEP 2017 Proceedings, P09, pp.563-565 (2017), 天童
Effect of High Temperature and Humidity Treatment on Adhesion Properties
and Bulk Properties of Structural Adhesive
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
ICEP 2017 Proceedings, P08, pp.559-562 (2017), 天童
Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature
Lead-free Solder and Gold-plated Electrode
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
ICEP 2017 Proceedings, P06, pp.551-554 (2017), 天童
A6061/SUS316Lの固相接合強度に及ぼすギ酸を用いた金属塩生成処理の効果
齋藤広輝, 石原重憲, 鶴岡茂樹, 小山真司, 荘司郁夫
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.445-446 (2017), 横浜
(001)および(111)配向銀めっき皮膜のセルフアニーリング過程における再結晶挙動
林佑美, 荘司郁夫, 小山真司, 宮澤寛
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.439-440 (2017), 横浜
電気化学的測定法を用いた銅及び銅合金の腐食特性に及ぼすブライン中の防錆剤の影響調査
樋口和成, 荘司郁夫, 小山真司, 安藤哲也, 水谷佳一, 井上行雄
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.419-424 (2017), 横浜
インサート材の金属塩被膜付与条件の最適化と鋳造用Al合金の接合界面への適用
西城舜哉, 小山真司, 荘司郁夫
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.401-404 (2017), 横浜
構造用接着剤の接着強度の劣化に及ぼす破壊形態および加水分解の影響
冨田雄吾, 荘司郁夫, 小山真司, 清水誠吾
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.227-230 (2017), 横浜
時効による高分子結合の変化に伴うエポキシ樹脂と銅との接着強度劣化挙動
戸野塚悠, 荘司郁夫, 小山真司, 外薗洋昭
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.223-226 (2017), 横浜
ピラー状金属間化合物分散鉛フリーはんだ接合の形成メカニズムに関する検討
中田裕輔, 倉澤元樹, 橋本富仁, 林和, 荘司郁夫
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.159-162 (2017), 横浜
ピラー状金属間化合物分散鉛フリーはんだ接合部の生成に及ぼす諸条件の効果
林和, 荘司郁夫, 小山真司, 中田裕輔, 橋本富仁
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc., pp.155-158
(2017), 横浜
Sn-5Sbの機械的特性とパワーサイクル環境下におけるSn-5Sb接合部の特性変化
小林恭輔, 荘司郁夫, 小山真司, 外薗洋昭
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.141-144 (2017), 横浜
Sn-57Bi-1Ag鉛フリーはんだ接合部のミクロ組織と接合強度に及ぼす電極材の影響
丸屋優樹, 秦英恵, 荘司郁夫, 小山真司
Mate 2017 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.99-102 (2017), 横浜
Liquid Phase Diffusion Bonding of AC2C and ADC12 Aluminum Casting Alloy
by using Metal Salt Coated Zn Sheet
Shunya Saijo, Shinji Koyama, Ikuo Shohji
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 063, pp.72 (2016), Kuala Lumpur,
Malaysia
Fracture Behaviours of Miniature Size Specimens of Sn-5Sb Lead-free Solder
under Tensile and Fatigue Conditions
Kyosuke Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 062, pp.71 (2016), Kuala Lumpur,
Malaysia
Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper
Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani,
Yukio Inoue
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 058, pp.69 (2016), Kuala Lumpur,
Malaysia
Degradation Behaviors of Adhesion Strength Between Epoxy Resin and Copper
under Aging at High Temperature
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 057, pp.69 (2016), Kuala Lumpur,
Malaysia
Degrdation Behaviors of Adhesion Strength of Structual Adhesive for Weld-Bonding
under High Temperature and Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 055, pp.68 (2016), Kuala Lumpur,
Malaysia
Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder
to Gold-Plated Copper
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 054, pp.67 (2016), Kuala Lumpur,
Malaysia
Change of Several Characteristics in Self-annealing of (001) Oriented Electrodeposited
Silver Films
Yumi Hayashi, Ikuo Shohji, Shinji Koyama, Hiroshi Miyazawa
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 053, pp.67 (2016), Kuala Lumpur,
Malaysia
Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints
Dispersed Pillar Shaped IMCS
Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomohito Hashimoto
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 052, pp.66 (2016), Kuala Lumpur,
Malaysia
ピラー状金属間化合物（ＩＭＣ）分散鉛フリーはんだ接合による高信頼性化検討
中田裕輔，倉澤元樹，橋本富仁，林和，荘司郁夫
MES 2016（第26回マイクロエレクトロニクスシンポジウム）論文集，pp.119-122 (2016)，名古屋
Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-free
Solder
Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono
Book of abstracts of THERMEC'2016, 516, pp.301 (2016), Graz, Austria
Comparison of Self-annealing Behaviors in (001)- and (111)-Oriented Electrodeposited
Silver Films by In Situ EBSP Analysis
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Book of abstracts of THERMEC'2016, 369, pp.229 (2016), Graz, Austria
Effect of Added Elements on Microstructures and Joint Strength of Lead-free
Sn-based Solder Joint Dispersed IMC Pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto
Book of abstracts of THERMEC'2016, 367, pp.228 (2016), Graz, Austria
Fe基ろうによるSUS304ろう付部の腐食挙動と電気化学的性質
角田貴宏, 石康道, 荘司郁夫, 松康太郎, 田口育宏
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.431-432 (2016), 横浜
(001)優先配向を示す銀めっき皮膜のセルフアニーリング挙動その場観察
林佑美, 荘司郁夫, 宮澤寛
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.405-408 (2016), 横浜
有限要素解析によるガラスインターポーザ実装基板の熱応力解析
窪田悠人, 荘司郁夫, 土田徹勇起, 中村清智
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.395-400 (2016), 横浜
パワーモジュール向けピラー状IMC分散鉛フリーはんだ接合部の開発
中田裕輔, 橋本富仁, 林和, 荘司郁夫
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.145-150 (2016), 横浜
ピラー状IMC分散鉛フリーはんだ接合部の組織と接合強度
林和, 荘司郁夫, 中田裕輔, 橋本富仁
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.141-144 (2016), 横浜
Sn-5Sb微小試験片の疲労特性に及ぼす温度の影響
小林恭輔, 荘司郁夫, 外薗洋昭
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.53-56 (2016), 横浜
Sn-1．0Ag-0．7Cu-1．6Bi-0．2In低銀鉛フリーはんだの疲労特性に及ぼす負荷条件の影響
髙橋祐樹, 荘司郁夫
Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.49-52 (2016), 横浜
Evaluation of self-annealing behavior of electrodeposited silver film by
EBSP analysis
Yumi Hayashi, Ikuo Shohji and Hiroshi Miyazawa
Proc. of 17th Electronics Packaging Technology Conference (EPTC), 141 (2015),
Singapore
Development of high reliability lead-free solder joint dispersed IMC pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata and Tomihito Hashimoto
Proc. of 17th Electronics Packaging Technology Conference (EPTC), 139 (2015),
Singapore
Effect of third element addition on joint strength of low-Ag lead-free
solder
Kyosuke Kobayashi, Ikuo Shohji and Mitsuo Yamashita
Proc. of 17th Electronics Packaging Technology Conference (EPTC), 138 (2015),
Singapore
Fatigue Properties and Fatigue Crack Propagation Behavior of Low-Ag Lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder
Yuki Takahashi and Ikuo Shohji
Program of InterPACK/ICNMM, pp.67 (2015), San Francisco, CA, USA
Tensile Properties and Microstructures of High Temperature Bi-based Lead-free
Solder
Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
Program of InterPACK/ICNMM, pp.67 (2015), San Francisco, CA, USA
Corrosion Behavior of SUS304 Brazed Joint with Fe-based Filler Alternative
to Ni-Based Filler
Takahiro Tsunoda, Ikuo Shohji, Kotaro Matsu, Kangdao Shi and Yasuhiro Taguchi
Program of InterPACK/ICNMM, pp.67 (2015), San Francisco, CA, USA
Thermal Stress Analysis of Mounted Substrate Using Glass Interposer
Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida and Kiyotomo Nakamura
Program of InterPACK/ICNMM, pp.61 (2015), San Francisco, CA, USA
エポキシフラックスの濡れ特性とはんだボール接合部の補強効果
石山旺欣, 荘司郁夫, 雁部竜也, 渡邉裕彦
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp.415-416
(2015), 横浜
短繊維強化PPSの機械的特性に及ぼす繊維含有量と温度の影響
髙橋諒伍, 荘司郁夫, 関祐貴, 丸山敏
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.413-414 (2015), 横浜
フリップチップ接合用アンダーフィル材の密着強度と疲労特性に及ぼすカップリング材の影響
三ツ木寛尚, 荘司郁夫, 小山真司
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.411-412 (2015), 横浜
有機基板に対するガラス配線基板の接続信頼性に及ぼす基板のCTE差の影響
土田徹勇起, 中村清智, 窪田悠人, 荘司郁夫
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp. 407-408 (2015), 横浜
Niろう代替Fe基ろうによるSUS304ろう付継手のミクロ組織と耐食性
角田貴宏, 荘司郁夫, 石康道, 松康太郎, 田口育宏
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp. 387-390 (2015), 横浜
Bi系高温鉛フリーはんだの引張特性に及ぼす温度と歪み速度の影響
張海東, 荘司郁夫, 下田将義, 渡邉裕彦
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp. 177-180 (2015), 横浜
Sn-1.0Ag-0.7Cu-1.6Bi-0.2In低銀鉛フリーはんだの疲労特性
髙橋祐樹, 荘司郁夫
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp. 165-168 (2015), 横浜
ガラスインターポーザ基板を用いた鉛フリーはんだ接合部の熱応力解析
窪田悠人, 荘司郁夫, 土田徹勇起, 中村清智
Mate 2015 (Microjoining and Assembly Technology in Electronics) Proc.,
pp. 29-32 (2015), 横浜
Tensile Properties of Low-melting Point Sn-Bi-Sb Solder
Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida and Kiyotomo Nakamura
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
pp. 788-792 (2014), Singapore
Joint Strength and Microstructures of Brazed Joints of Stainless Steel
with Fe-based Filler
Takahiro Tsunoda, Kangdao Shi, Ikuo Shohji, Kotaro Matsu and Yasuhiro Taguchi
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
pp. 855-858 (2014), Singapore
Mechanical Properties of Low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder
Yuki Takahashi and Ikuo Shohji
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
pp.784-787 (2014), Singapore
Effect of Temperature on Tensile Properties of High-melting Point Bi System
Solder
Haidong Zhang, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
pp.780-783 (2014), Singapore
Effect of Fiber Direction and Temperature on Fatigue Behaviors of Short
Fiber-Reinforced PPS
Ryogo Takahashi, Ikuo Shohji, Yuki Seki and Satoshi Maruyama
Final Program of MS&T14, pp. 125 (2014), Pittsburgh, Pennsylvania,
USA
Improvement Effect of Joint Reliability of Sn-3Ag-0.5Cu Solder Ball Joint
with Epoxy-based Flux
Akiyoshi Ishiyama, Ikuo Shohji, Tatsuya Ganbe and Hirohiko Watanabe
Final Program of MS&T14, pp. 125 (2014), Pittsburgh, Pennsylvania,
USA
Effect of Coupling Treatment of Filler and Copper Substrate on Adhesion
of Underfill
Hironao Mitsugi, Ikuo Shohji and Shinji Koyama
Final Program of MS&T14, pp. 125 (2014), Pittsburgh, Pennsylvania,
USA
Effect of Fiber Direction and Temperature on Mechanical Properties of Short
Fiber-Reinforced PPS
R. Takahashi, I. Shohji, Y. Seki and S. Maruyama
Proc. of ICEP 2014 (CD-ROM), pp.778-781 (2014), Toyama
Effect of Coupling Agent on Adhesion of Underfill on Copper
H. Mitsugi, I. Shohji, S. Koyama and S. Kitagoh
Proc. of ICEP 2014 (CD-ROM), pp.774-777 (2014), Toyama
Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux
A. Ishiyama, I. Shohji, T. Ganbe and H. Watanabe
Proc. of ICEP 2014 (CD-ROM), pp.766-769 (2014), Toyama
溶融Snとプラズマ窒化ステンレス鋼の界面反応
服部真吾, 荘司郁夫, 桑原秀行
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.397-398 (2014), 横浜
酢酸を用いた金属塩生成接合法によるAl合金/SUS304の固相接合条件の緩和
松原広太, 小山真司, 荘司郁夫
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.389-390 (2014), 横浜
金属塩生成接合法によるCu/Cu固相接合条件の緩和
萩原尚基, 小山真司, 荘司郁夫
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.387-388 (2014), 横浜
双ロール法により作製した高Al含有Mg合金の時効硬化とミクロ組織
秋山主, 荘司郁夫, 小山真司, 西田進一, 渡利久規, 藤倉圭佑
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.373-376 (2014), 横浜
短繊維強化樹脂材料の機械的特性に及ぼす繊維方向および温度の影響
髙橋諒伍, 荘司郁夫, 関祐貴, 丸山敏
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.369-372 (2014), 横浜
リチウムイオン二次電池用電解銅箔の疲労特性に及ぼす添加剤の影響
永山卓弥, 荘司郁夫, 西貞造, 呉元元
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.357-360(2014), 横浜
Sn-3Ag-0.5CuはんだとW基板上Ni-Bめっきメタライズ界面に生成するSn-W構造
依田智子, 原田正英, 西川徹, 小林竜也, 荘司郁夫
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.291-296 (2014), 横浜
フリップチップ接合用アンダーフィル材の機械的物性に及ぼすカップリング剤の影響
三ツ木寛尚, 荘司郁夫, 小山真司, 北郷慎也
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.279-282 (2014), 横浜
エポキシ系フラックスによるボール接合部衝撃特性の向上効果
石山旺欣, 荘司郁夫, 雁部竜也, 渡邉裕彦
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.251-254 (2014), 横浜
Sb, Zn添加Sn-Bi系はんだと無電解Ni/AuおよびNi/Pd/Au電極の接合特性に及ぼす時効の影響
平田晃大, 荘司郁夫, 土田徹勇起, 大久保利一
Mate 2014 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.51-54 (2014), 横浜
Change of Characterization in Electroless Plating Ni-B Alloy Films by Heat
Treatment
Chiko Yorita, Takayoshi Watanabe, Hiroshi Kikuchi, Toru Nishikawa, Masahide
Harada and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.675-676 (2013), Las Vegas, USA
Effect of Strain Rate on Tensile Properties of Miniature Size Specimens
of Several Lead-free Alloys (invited)
Ikuo Shohji and Yuichiro Toyama
Book of Abstracts of THERMEC’2013, pp.558-559 (2013), Las Vegas, USA
Effect of the contents of Se in high-cyanide silver plating solution on
200 orientation of the silver electro-deposited layer
Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and
Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.421-422 (2013), Las Vegas, USA
Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding
Technique with Acetic Acid
Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.396-397 (2013), Las Vegas, USA
Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with
Formic Acid and Citric Acid
Naoki Hagiwara, Shinji Koyama and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.216 (2013), Las Vegas, USA
Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with
Fine Diameter Specimens
Takashi Hisada, Ikuo Shohji, Yasuharu Yamada, Kazushige Toriyama and Mamoru
Ueno
Proc. of IEEE CPMT Symposium Japan 2013, pp.205-208 (2013), 京都
アンダーフィル材の引張特性に及ぼすフィラー添加量および熱劣化の影響
三ツ木寛尚, 北郷慎也, 荘司郁夫, 小山真司
第３回電子デバイス実装研究委員会資料, pp. 37-44 (2013), 大阪
Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic
Copper Foil
Takuya Nagayama, Hiroaki Yoshida and Ikuo Shohji
Proc. of InterPACK2013 (CD-ROM), IPACK2013-73172 (2013), Burlingame, California,
USA
Effect of Electrode Material on Joint Strength of Soldered Joints with
Sn-Bi and Sn-Bi-Sb Lead-free Solder Balls
Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo
Proc. of InterPACK2013 (CD-ROM), IPACK2013-73171 (2013), Burlingame, California,
USA
Interfacial Reaction between Molten Sn and Plasma Nitrided Stainless Steel
Shingo Hattori, Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara
Proc. of InterPACK2013 (CD-ROM), IPACK2013-73170 (2013), Burlingame, California,
USA
鉛フリーはんだ微小試験片の引張特性に及ぼすミクロ組織とひずみ速度の影響
當山雄一郎, 荘司郁夫
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc., pp.459-460
(2013), 横浜
リチウムイオン二次電池用電解銅箔の機械的特性に及ぼす添加剤の影響
永山卓弥, 吉田浩亮，荘司郁夫, 西貞造, 呉元元
Mate 2013 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.341-344 (2013), 横浜
純Snによるプラズマ窒化ステンレス鋼の侵食挙動に及ぼす温度の影響
服部真吾, 松原尚也, 荘司郁夫, 桑原秀行
Mate 2013 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.287-290 (2013), 横浜
Sn-Bi系鉛フリーはんだボールと無電解Ni/AuおよびNi/Pd/Au電極の接合特性
平田晃大, 荘司郁夫, 土田徹勇起, 大久保利一
Mate 2013 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.231-234 (2013), 横浜
フリップチップ接合用アンダーフィル材の材料物性に及ぼす温度およびフィラー添加量の影響
北郷慎也, 三ツ木寛尚, 荘司郁夫, 小山真司
Mate 2013 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.171-176 (2013), 横浜
A Study of Bonding Strength of Al/Cu by Metal Salt Generation Bonding Method
S. K. Ting, Hirokazu Hata, Shinji Koyama and Ikuo Shohji
Proc. of Visual-JW2012, pp. 192-193 (2012), Osaka
A Study of Solid State Bonding Strength of Al/Cu by Using Metal Salt Generation
Bonding Method on Al Surface
Shinji Koyama, S. K. Ting, Ikuo Shohji, Hirokazu Hata, Naoki Hagiwara
and Kota Matsubara
Proc. of Visual-JW2012, pp. 167-168 (2012), Osaka
Effect of Strain Rate on Tensile Properties of Miniature Size Lead-Free
Alloys
Yuichiro Toyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P151 (2012), Ipoh, Malaysia
Effect of Filler Content on Tensile Properties of Underfill Material for
Flip Chip Bonding
Shinya Kitagoh, Hironao Mitsugi, Shinji Koyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P150 (2012), Ipoh, Malaysia
Effect of Surface Modification by Citric Acid on Fluxless Vacuum Bonding
of Cu with Sn-Cu Alloy
Masumi Hayakawa, Shinji Koyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P149 (2012), Ipoh, Malaysia
Effect of Ni, Ge and P Addition in Sn-Ag-Cu Lead-free Solder on Solder
Joint Properties with Electroless Ni/Au Electrodes
Ikuo Shohji and Ryohei Arai
Proc. of IEMT 2012, IEMT2012-P032 (2012), iPoh, Malaysia
Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder
Ball
Maryam Husna Yahya, Keisuke Nakamura, Ikuo Shohji, Toshihiro Housen, Yumi
Yamamoto and Yoshio Kaga
Proc. of IEMT 2012, IEMT2012-P031 (2012), Ipoh, Malaysia
Effect of Substrate Material on Thermal Fatigue Life of Solder Joint of
WLCSP
S. Kitagoh, I. Shohji, M. Miyazaki, J. Watanabe, K. Hatsuzawa
Proc. of ICEP-IAAC 2012 (CD-ROM), pp. 693-696 (2012), Tokyo
Investigation of Impact Properties of Lead-free Solders using Micro-size
Specimens
Y. Toyama, I. Shohji
Proc. of ICEP-IAAC 2012 (CD-ROM), pp. 669-672 (2012), Tokyo
Microstructures and Joint Strength of Vacuum Jointed Cu with Sn-Cu Alloys
M. Hayakawa, I. Shohji, S. Koyama, H. Nara, N. Otomo, M. Uenishi
Proc. of ICEP-IAAC 2012 (CD-ROM), pp. 661-664 (2012), Tokyo
鉛フリーめっき液を用いた無電解Ni/Au およびNi/Pd/Au めっき電極の接合特性
狩野貴宏, 荘司郁夫, 土田徹勇起, 大久保利一
Mate 2012 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.439-440 (2012), 横浜
Sn-Pb 共晶はんだ微小試験片の引張特性に及ぼすAu,PdおよびBi添加の影響
菊池遼, 荘司郁夫, 根本規生, 中川剛, 海老原伸明, 岩瀬房雄
Mate 2012 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.433-434 (2012), 横浜
WLCSPはんだ接合部の熱疲労寿命に及ぼす基板材質の影響
北郷慎也, 荘司郁夫, 宮崎誠, 渡辺潤, 初澤健次
Mate 2012 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.377-380 (2012), 横浜
Sn-Cu系鉛フリーはんだによるCuの真空接合部の接合部組織と接合強度
早川真生, 荘司郁夫, 小山真司, 奈良英明, 大友昇, 上西正久
Mate 2012 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.85-88 (2012), 横浜
鉛フリーはんだ微小試験片の高速引張特性
當山雄一郎, 荘司郁夫
Mate 2012 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.65-68 (2012), 横浜
The Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating
against Lead-Free Solder
Jun Watanabe, Norihisa Sekimori, Kenji Hatsuzawa, Takashi Uetani and Ikuo
Shohji
Proceedings of ECO-MATES 2011, Vol.2, pp.47-48 (2011), Osaka
Effect of the Organic Acid Surface Modification on Bond Strength of Tin
and Copper
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52072 (2011), Portland, USA
Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu
Lead-Free Solder
Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52026 (2011), Portland, USA
Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb
Solder With Small Amounts of Au and Pd for Aerospace Application
Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa,
Nobuaki Ebihara and Fusao Iwase
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52025 (2011), Portland, USA
Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free
Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode
Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52024 (2011), Portland, USA
Sn-Ag-Cu系鉛フリーはんだによるプラズマ窒化ステンレス鋼の侵食挙動
松原尚也, 住吉一仁, 荘司郁夫, 桑原秀行
Mate 2011 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.359-360 (2011), 横浜
多層カーボンナノチューブを用いた高熱伝導性アンダーフィル材の検討
渡辺潤, 宮崎誠, 初澤健次, 荘司郁夫
Mate 2011 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.353-354 (2011), 横浜
無電解Ni/Pd/Auめっき電極と鉛フリーはんだとの接合特性に及ぼすPdめっき厚の影響
狩野貴宏, 荘司郁夫, 土田徹勇起, 大久保利一
Mate 2011 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.333-334 (2011), 横浜
実装基板の接続信頼性に及ぼす基板材料特性の影響
宮崎誠, 渡辺潤, 初澤健次, 北郷慎也, 荘司郁夫
Mate 2011 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.159-164 (2011), 横浜
Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test
under high strain rate (Invited Lecture)
Kiyokazu Yasuda, Yoshihiro Sakin, Ikuo Shohji and Tadashi Takemoto
Proc. of Visual-JW 2010, Vol. 2, p.29-30 (2010), Osaka
Examination of improvement effect of surface modification of Cu with organic
acid on solder paste wettability using a laser displacement meter
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Proc. of Visual-JW 2010, Vol. 1, pp.193-194 (2010), Osaka
Development of wettability evaluation equipment for solder paste using
laser displacement method
Shinji Koyama, Issei Oya, Toshihiro Isaka, Ikuo Shohji, Masashi Nishimuro,
Kiyoshi Hiramoto and Hironaga Miyamoto
Proc. of Visual-JW 2010, Vol. 1, pp.191-192 (2010), Osaka
Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue
Life for Chip Size Package Solder Joints
Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.98 (2010),
Kuala Lumpur, Malaysia
Effect of interfacial reaction on joint strength of semiconductor metallization
and Sn-3Ag-0.5Cu solder ball
Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.47 (2010),
Kuala Lumpur, Malaysia
Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge
Solder Alloy
Hirohiko Watanabe, Masayoshi Shimoda, Noboru Hidaka and Ikuo Shohji
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.29 (2010),
Kuala Lumpur, Malaysia
Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge
Alloy
Ikuo Shohji, Ryohei Arai, Hisao Ishikawa and Masao Kojima
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.23 (2010),
Kuala Lumpur, Malaysia
Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge
Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa and Ikuo Shohji
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.23 (2010),
Kuala Lumpur, Malaysia
Sn-Ag-Cu-Ni-Ge系はんだ中へのCuの溶解特性に及ぼすNi添加量の影響
永井麻里江, 渡邉裕彦, 大澤勤, 荘司郁夫
Mate 2010 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.225-228 (2010), 横浜
Sn-Ag-Cu-Ni-Ge系はんだの強度特性に及ぼすAg添加量の影響
新井亮平, 荘司郁夫, 石川久雄, 小島昌夫
Mate 2010 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.147-150 (2010), 横浜
半導体電極用メタライゼーションとSn-3Ag-0.5Cuはんだとの界面反応
小林竜也, 荘司郁夫, 依田智子
Mate 2010 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.27-30 (2010), 横浜
Development of Joining Technology of Al Alloy Plate and Cu Alloy Pipe for
Cooling System of Power Module
I. Oshiro, I. Shohji, H. Nara, N. Otomo and M. Uenishi
Proc. of ICEP (International Conference of Electronics Packaging) 2009,
pp.951-954 (2009), Kyoto
Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb
Solder for Aerospace Application
Y. Saitoh, I. Shohji, N. Nemoto, T. Nakagawa, N. Ebihara and F. Iwase
Proc. of ICEP (International Conference of Electronics Packaging) 2009,
pp.947-950 (2009), Kyoto
Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten
Sn-3Ag-0.5Cu Solder
K. Sumiyoshi, I. Shohji and M. Miyazaki
Proc. of ICEP (International Conference of Electronics Packaging) 2009,
pp.943-946 (2009), Kyoto
溶融鉛フリーはんだによるSUS304鋼とSUS316鋼の侵食速度比較
住吉一仁, 荘司郁夫, 高瀬博之, 宮崎誠
Mate 2009 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.395-398 (2009), 横浜
The Effects of Ag, Ni, and Ge Elements in Lead-free Sn Base Solder Alloy
Mitsuo Yamashita, Noboru Hidaka and Ikuo Shohji
Proc. of Electronics Packaging Technology Conference 2008, pp.582-587
(2008), Singapore
Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
Pacific Rim Meeting on Electrochemical and Solid-State Science, Abs. 0090
(2008), Honolulu, Hawaii, USA
Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint
Ikuo Shohji, Tsutomu Osawa, Takeshi Okashita and Hirohiko Watanabe
Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International
Conference on Fracture and Damage
Mechanics (FDM 2008), pp.745-748 (2008), Seoul, Korea
Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size
Package Solder Joint
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi
Ogawa and Takayuki Kawano
Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International
Conference on Fracture and Damage
Mechanics (FDM 2008), pp.433-436 (2008), Seoul, Korea
Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder
Ball Joints
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International
Conference on Fracture and Damage
Mechanics (FDM 2008), pp.429-432 (2008), Seoul, Korea
微小試験片による各種鉛フリーはんだの引張特性評価
大澤勤, 荘司郁夫, 松木孝樹, 苅谷義治, 安田清和, 竹本正
Mate 2008 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.115-118 (2008), 横浜
Sn-Ag-Cu-Ni-Geはんだ接合界面の反応層形成について
渡邉裕彦, 下田将義, 荘司郁夫, 大澤勤
Mate 2008 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.83-88 (2008), 横浜
高温放置環境下におけるSn-8Zn-3Biはんだと無電解Ni/Auめっき電極との界面反応
下山悟志, 荘司郁夫, 石川久雄, 小島昌夫
Mate 2008 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.75-78 (2008), 横浜
Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package
Solder Joints
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi
Ogawa and Takayuki Kawano
Program & Abstracts of The Second International Symposium on Smart
Processing Technology, p.112 (2007), Osaka
Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn
Solder Joints on Electroless Ni/Au Plated Electrodes
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Program & Abstracts of The Second International Symposium on Smart
Processing Technology, p.110 (2007), Osaka
Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders
Evaluated by Micro Size Specimens
Ikuo Shohji, Tsutomo Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu
Yasuda and Tadashi Takemoto
Program & Abstracts of The Second International Symposium on Smart
Processing Technology, p.109 (2007), Osaka
Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu
Lead-Free Solders Using Strain Rate Sensitivity Index
Kiyokazu Yasuda, Ikuo Shohji and Tadashi Takemoto
Abstract Book IWJC-Korea 2007 (International Welding and Joining Conference-Korea
2007), pp. 94-95 (2007), Osaka
Sn-Ag系鉛フリーはんだの低サイクル疲労と表面変形度合の関係
高橋武彦, 日置進, 荘司郁夫, 神谷修
Mate 2007 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.227-232 (2007), 横浜
Influence of Content of Ni and Ag on Microstructure and Joint Strength
of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe and Tatsuhiko Asai
Abstracts and Program of 2006 Asian Pacific Conference for Fracture and
Strength, pp.293 (2006), Hainan, China
Influence of Properties of Underfill Materials on Thermal Stress Relief
in Lead-Free Solder Joint of Chip Size Package
Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano
Abstracts and Program of 2006 Asian Pacific Conference for Fracture and
Strength, pp.292 (2006), Hainan, China
Development of Cu Brazing Sheet with Cu-P Composite Plating
Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo and Masahisa Uenishi
Abstracts and Program of 2006 Asian Pacific Conference for Fracture and
Strength, pp.292 (2006), Hainan, China
Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge
Lead-Free Solder
Hirohiko Watanabe, Noboru Hidata, Ikuo Shohji and Mototaka Ito
Proceedings of Materials Science and Technology (MS&T) 2006: PRODUCT
MANUFATURING, pp.135-146 (2006),
cincinnati, Ohio, USA
New Lead Free Solder Composition and Physical Properties of Printed Wiring
Board Laminate Material To Suppress Lift-Off and Improve Reliability
Kenichi Ikeda, Hideki Ishihara, Hirohiko Watanabe, Tatsuhiko Asai, Hiroaki
Hokazono and Ikuo Shohji
Proceedings of IPC Printed Circuits Expo, APEX and the Designers Summit
2006, S39-02 (2006), Anaheim, CA, USA
Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの接合部組織および接合強度に及ぼすNi添加量の影響
角田智史, 荘司郁夫, 渡邉裕彦, 浅井竜彦
Mate 2006 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.279-284 (2006), 横浜
CSPはんだ接合部の熱応力緩和に及ぼすアンダーフィル材の影響
吉澤啓介, 荘司郁夫, 西元正治, 川野崇之
Mate 2006 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.275-278 (2006), 横浜
Sn-3.5Ag, Sn-0.7Cu鉛フリーはんだの表面変形度合による低サイクル疲労特性評価
高橋武彦, 日置進, 荘司郁夫, 神谷修
Mate 2006 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.253-258 (2006), 横浜
ウイスカ抑制Pbフリーはんだペースト
林田喜任, 髙橋義之, 大野隆生, 荘司郁夫
Mate 2006 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.39-44 (2006), 横浜
Thermal stress relief in lead-free solder joint for chip size package with
encapsulant materials
Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano
Program & Abstract of International Symposium on Smart Processing
Technology, p.26 (2005), Osaka
An Evaluation of Fatigue Damage in Low-cycle Range for Sn-3.5Ag, Sn-0.7Cu
Lead-free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Proceedings of IPACK2005 (CD-ROM), IPACK2005-73152, (2005), San Francisco,
USA
Comparison of Immersion Gold Plating in Reliability of a Lead-Free Solder
Joint with Autocatalytic Electroless Gold Plating
Kiyotomo Nakamura, Ikuo Shohji, Hiroki Goto, and Toshikazu Ookubo
Proceedings of the 7th International Conference on Ecomaterials, pp.347-353
(2005), Singapore
Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free
Solder Joint
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Proceedings of the 7th International Conference on Ecomaterials, pp.309-315
(2005), Singapore
Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat
Exposure Conditions
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe,Tatsuhiko Asai and Megumi
Nagano
Proceedings of the 7th International Conference on Ecomaterials, pp.248-254
(2005), Singapore
Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu
Lead-free Solder
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Proceedings of the 6th International Conference on Fracture and Strength
of Solids Part 1, pp.120-125 (2005) , Bali, Indonesia
誘電体被膜を有するアルミニウム箔とパラジウム電極との超音波接合
櫻井司, 荘司郁夫, 大島雅史
Mate 2005 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.395-398 (2005), 横浜
リフトオフ現象抑制のための新規鉛フリーはんだとプリント基板材料特性
池田謙一, 石原秀樹, 渡邉裕彦, 浅井竜彦, 外薗洋昭, 荘司郁夫
Mate 2005 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.343-348 (2005), 横浜
Sn-0.7Cu鉛フリーはんだの低サイクル疲労特性および画像を用いた疲労被害評価
高橋武彦, 日置進, 荘司郁夫, 神谷修
Mate 2005 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.297-302 (2005), 横浜
鉛フリーはんだの接合部信頼性に及ぼす置換・還元型Auめっき層の影響
後藤広樹, 荘司郁夫, 中村清智, 大久保利一
Mate 2005 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.183-188 (2005), 横浜
Joint Strength and Microstructure of microjoint with Sn-Ag-In-Bi Lead-free
Solder
Ikuo Shohji and Hitoshi Ninomiya
Proceedings of New Frontiers of Process Science and Engineering in Advanced
Materials '04, pp.227-232 (2004), Kyoto
Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure
of Solder Joint with Sn-3Ag-0.5Cu
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Final Program and Abstructs of Asian Pacific Conference for Fracture and
Strength'04, pp.421 (2004), Jeju, Korea
High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic
Bonding for High-Frequency Chip Coil
Ikuo Shohji, Tsukasa Sakurai and Shinji Arai
Final Program and Abstructs of Asian Pacific Conference for Fracture and
Strength'04, pp.416 (2004), Jeju, Korea
Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base
Filler Metals Added Cr Powder
Ikuo Shohji, Satoshi Takayama, Takanori Nakazawa, Ken Matsumoto and Masanori
Hikita
Final Program and Abstructs of Asian Pacific Conference for Fracture and
Strength'04, pp.212 (2004), Jeju, Korea
Mechanical Properties of Various Lead-free Solders
Takehiko Takahashi, Susumu Hioki, Osamu Kamiya and Ikuo Shohji
Proc. of The 2nd International Conference on Structure, Processing and
Properties of Materials, SPPM2004, pp.778-785 (2004)
高周波巻線チップコイル用高速接合技術の開発
荘司郁夫, 新井慎二, 櫻井司, 久米原宏之, 薄波圭司, 木村由孝, 須齋嵩
Mate 2004 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.231-236 (2004), 横浜
Tensile Properties of Sn-0.7mass%Cu Lead-free Solder
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Abstracts 2 of The 8th IUMRS International Conference on Advanced Materials
2003, pp.38 (2003), Yokohama
Effect of Ni Coating over Cu Ball on the Microstructure of Flip Chip Joints
with Cu-corred Solder Balls
Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira
Ichida
Proc. of InterPACK03(CD-ROM), InterPack2003-35120 (2003), Maui, USA
低融点鉛フリーはんだの引張特性
荘司郁夫, 吉田知弘, 高橋武彦, 日置進
Mate 2003 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.229-234 (2003), 横浜
各種鉛フリーはんだの引張特性
高橋武彦, 日置進, 荘司郁夫, 吉田知弘
Mate 2003 (Microjoining and Assembly Technology in Electronics) Proc.,
pp.223-228 (2003), 横浜
Sn-Zn系鉛フリーはんだ/Cu接合体の接合部組織と機械的特性
荘司郁夫, 中村隆夫, 森史成, 藤内伸一
Mate 2002 (Microjoining and Assembly Technology in Electronics)Proc., pp.289-294
(2002), 横浜
Brazing of stainless steel with CuP filler
Shohji Ikuo, Fujihira Mitsuhiro, Nakazawa Takanori, Uenishi Masahisa and
Otomo Noboru
Proc. of 2001 International Brazing & Soldering Conference, pp.83-88
(2001),Yangzhong, China
Thermal Fatigue Behavior of CSP Solder Joints with Sn-Ag Lead-free Solders
under Thermal Cycle Conditions
Ikuo Shohji, Fuminari Mori, Shinichi Fujiuchi and Masaru Yamashita
Proc. of 2001 International Conference on Electronics Packaging, pp.296-301
(2001), Tokyo
無電解NiバンプとPbフリーはんだを用いたフリップチップ接合部の熱疲労強度評価
荘司郁夫，森史成
Mate 2001 (Microjoining and Assembly Technology in Electronics)Proc., pp.101-106
(2001), 横浜
Flip Chip Attach Technology by Au Bump and In Alloy Solder
I.Shohji, T.Yamada and H.Kimura
Proc. of the 9th IMC(International Microelectronics Conference), pp.314-317
(1996), 大宮
ワイヤボンド用チップを用いたフリップチップアタッチ実装技術
荘司郁夫, 山田毅, 木村英夫, 折井靖光, 藤内伸一, 酒井俊廣
Mate'96 (Microjoining and Assembly Technology in Electronics) Proc., pp.17-22
(1996), 横浜
Other Metal BumpによるFlip Chip Attach実装技術の開発
荘司郁夫, 山田毅, 木村英夫
第６回MES'95（マイクロエレクトロニクスシンポジウム）論文集, pp.127-130 (1995), 大宮
The Design of Flip chip Joint by Other Metal Bump - Flip Chip Attach Technology
Y.Tsukada, N.Watanuki, S.Okamoto and I.Shohji
Proc. of the 8th IMC(International Microelectronics Conference), pp.419-424
(1994), 大宮