- Degradation Mechanism of Structural Adhesive under High Temperature and
High Humidity Conditions
Hitomi ABIKO, Kosaku NAKAYAMA, Tatsuya KOBAYASHI, Ikuo SHOHJI, Yugo TOMITA, Tatsunori MATSUNAGA
Proc. of Visual-JW2019 & WSE 2019, PT-34, pp.231-232 (2019), Osaka
- Investigation of Corrosion Resistance of Nickel-based Brazing Filler Metal
for Stainless Steel by
Electrochemical Measurement
Yusuke FUKAI, Tatsuya KOBAYASHI, Ikuo SHOHJI, Tetsuya ANDO, Takuya YOSHIDA, Tsuyoshi KASHIWASE,
Noboru OTOMO
Proc. of Visual-JW2019 & WSE 2019, PT-41, pp.245-246 (2019), Osaka
- Investigation of High Temperature Fatigue Properties and Microstructures
of Sn-Sb-Ag alloys
Kohei MITSUI, Tatsuya KOBAYASHI, Ikuo SHOHJI, Hirohiko WATANABE
Proc. of Visual-JW2019 & WSE 2019, PT-42, pp.247-248 (2019), Osaka - Investigation of Corrosion Behaviour of Nickel Brazing Filler Metal for
Exchanger by Electrochemical
Measurement
Yusuke Fukai, Ikuo Shohji, Tetsuya Ando, Takuya Yoshida, Tsuyoshi Kashiwase, Noboru Otomo
Mate 2019(Microjoining and Assembly Technology in Electronics) Proc., pp.375-378 (2019), Yokohama - High Temperature Fatigue Properties of Sn-5Sb and Sn-Sb-Ag Ternary Eutectic
Alloys
Kohei Mitsui, Ikuo Shohji
Mate 2019(Microjoining and Assembly Technology in Electronics) Proc., pp.327-332 (2019), Yokohama - Microstructures and Mechanical Properties of Sn-Sb-Ni High Temperature
Lead-free Solders
Tatsuya Kobayashi, Kohei Mitsui, Ikuo Shohji
Mate 2019(Microjoining and Assembly Technology in Electronics) Proc., pp.321-326 (2019), Yokohama - Effect of High-Temperature and High-Humidity Environment on Degradation
of Adhesion Strength of
Structural Adhesive
Hitomi Abiko, Ikuo Shohji, Seigo Shimizu, Yugo Tomita
Mate 2019(Microjoining and Assembly Technology in Electronics) Proc., pp.213-216 (2019), 横浜 - Finite Element Method Analysis of Densification Process of Sintered Steelfor
Automobile in Cold Forging
Y. Morokuma, Y. Kamakoshi, S.Nishida, I. Shohji
ATE-2018 Abstract Conference Proceeding DVD, 14 (2019), Bangkok - Residual Stress Analysis in Glass Substrate for Electronic Packaging byFinite
Element Method
A. Shinohara, I. Shohji, and Y. Umemura
Final Program & Abstract Book of 4th International Conference on Nanojoiningand Microjoining 2018 (NMJ2018) ,
P32 (2018), Nara
- Micro-brazing of Stainless Steel using Ni-P Alloy Plating
Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi,Tsunehito Wake and Susumu Arai
Final Program & Abstract Book of 4th International Conference on Nanojoiningand Microjoining 2018 (NMJ2018) ,
P31 (2018), Nara
- Erosion Resistance Properties of Iron-carbon Composite Plating to MoltenLead-free
Solder
J. Watanabe, K. Hatsuzawa, S. Ogata, S. Yoshida, and I. Shohji
Final Program & Abstract Book of 4th International Conference on Nanojoiningand Microjoining 2018 (NMJ2018) ,
P21 (2018), Nara
- Effect of Ni Addition on Tensile and Fatigue Properties of Sn-Sb Alloy
T. Kobayashi, K. Mitsui, and I. Shohji
Final Program & Abstract Book of 4th International Conference on Nanojoiningand Microjoining 2018 (NMJ2018) ,
P16 (2018), Nara
- Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge
Lead-Free Solder
Masaki Yokoi, Kobayashi Tatsuya, Shohji Ikuo
Book of abstracts of THERMEC'2018, 1548, pp.1045 (2018), Paris, France
- Investigation of Crack initiation in Glass Substrate by Residual Stress
analysis
Amon Shinohara, Kobayashi Tatsuya, Shohji Ikuo, Umemura Yuki
Book of abstracts of THERMEC'2018, 1519, pp.1028 (2018), Paris, France
- A Study on Reliability of Pillar-Shaped intermetallic Compounds Dispersed
Lead-Free Solder Joint
Yusuke Nakata, Kurasawa Motoki, Hashimoto Tomihito, Miki Kenji, Shohji Ikuo
Book of abstracts of THERMEC'2018, 1492, pp.1012 (2018), Paris, France
- Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging
Process
Yuki Morokuma, Nishida Shinichi, Kamakoshi Yuichiro, Kanbe Koshi, Kobayashi Tatsuya, Shohji Ikuo
Book of abstracts of THERMEC'2018, 1487, pp.1009 (2018), Paris, France
- Effect of Cooling Rate on intermetallic Compounds Formation in Sn-Ag-Cu-In
Solder
Kenji Miki, Kobayashi Tatsuya, Shohji Ikuo, Nakata Yusuke
Book of abstracts of THERMEC'2018, 1479, pp.1004 (2018), Paris, France
- Microstructure and Mechanical Properties of Welded Joints of Several High
Tensile Strength Steel
Takahiro Izumi, Kobayashi Tatsuya, Shohji Ikuo, Miyanaga Hiroaki
Book of abstracts of THERMEC'2018, 1445, pp.984-985 (2018), Paris, France - Large Deformation Simulation of Porous Material by Finite Element Method
Yuki Morokuma, Yuichiro Kamakoshi, Shinichi Nishida, Ikuo Shohji
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.257-260 (2018), 横浜
- Investigation of Crack Initiation Mechanism in Glass Substrate
Amon Shinohara, Ikuo Shohji, Yuki Umemura
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.221-224 (2018), 横浜
- Lifetime Evaluation of Adhesion Interface between Copper and Epoxy Resin
by Thermal Humidity Test
Yu Tonozuka, Ikuo Shohji, Hiroaki Hokazono, Kuniaki Takahashi, Toku Ezure
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.109-114 (2018), 横浜
- Effect of Temperature on Tensile Properties and Fatigue Properties of Miniature
Size Specimen of
Sn-Ag-Cu-Ni-Ge
Masaki Yokoi, Ikuo Shohji
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.75-78 (2018), 横浜
- Effect of Ag Electrode on Low Temperature Bonding using Sn-57Bi-1Ag Lead-free
Solder
Yuki Maruya, Hanae Hata, Ikuo Shohji
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.61-64 (2018), 横浜
- A Study on Reliability of Pillar-shaped Intermetallic Compounds Dispersed
Lead-free Solder Joint
Yusuke Nakata, Yawara Hayashi, Motoki Kurasawa, Tomihito Hashimoto, Kenji Miki, Ikuo Shohji
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.21-24 (2018), 横浜
- Effect of Cooling Rate on Formation of Lead-Free Solder Joint Dispersed
Pillar-Shaped Intermetallic
Compouds
Kenji Miki, Ikuo Shohji, Yusuke Nakata, Yawara Hayashi
Mate 2018(Microjoining and Assembly Technology in Electronics) Proc., pp.17-20 (2018), 横浜 - Comparison between Sn-Sb and Sn-Ag-Cu-Ni-Ge alloys in Tensile Properties
Using Miniature Size
Specimen
Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, Ikuo Shohji
The Electronic Packaging Interconnect Technology Symposium (EPITS 2017) Conference Program Book, pp.24 (2017), Fukuoka - Novel Development of Lead-free Solder and Their Mechanical Properties(invited)
Ikuo Shohji
The Electronic Packaging Interconnect Technology Symposium (EPITS 2017) Conference Program Book, pp.11 (2017), Fukuoka - Change in Chemical Structure of Structural Adhesive under High Temperature
and Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
Program of InterPACK2017, pp.64 (2017), San Francisco, CA, USA
- Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene
Glycol with Rust Inhibitor
Kazunari Higuchi, Ikuo Shohji, Shinji Koyama, Tetsuya Ando, Yoshikazu Mizutani, Yukio Inoue
Program of InterPACK2017, pp.64 (2017), San Francisco, CA, USA
- Effect of Surface Finish of Cu Electrode on Characteristics of High Melting
Point Joint Using Sn-57Bi-1Ag
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
Program of InterPACK2017, pp.63 (2017), San Francisco, CA, USA
- Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its
Degradation Mechanism
under Aging
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Program of InterPACK2017, pp.62 (2017), San Francisco, CA, USA
- Improvement of Mechanical Strength of Sintered Mo Alloyed Steel by Optimization
of Sintering and
Cold-ForgingProcesses with Densificatiom
Y Kamakoshi, I Shohji, Y Inoue, S Fukuda
ICMER2017 Proceedings, IC011, pp.13-14(2017), Pahang, Malaysia - Finite Element Method Analysis of Cold-forging For Deformation and Densification
of Mo alloyed
Sintered Steel
Y Kamakoshi, S Nishida, K Kanbe, I Shohji
ICMER2017 Proceedings, IC012, pp.15(2017), Pahang, Malaysia
- Formation Mechanism of Pillar-Shaped Intermetallic Compounds Dispersed
Lead-Free Solder Joint
Y Nakata, T Hashimoto, M Kurasawa, Y Hayashi, I Shohji
ICMER2017 Proceedings, IC014, pp.18(2017), Pahang, Malaysia - Electrochemical Corrosion of Copper and Copper Alloy in Aqueous Propylene
Glycol Containing Rust
Inhibitors
Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani, Yukio Inoue
ICEP 2017 Proceedings, P14, pp.582-585 (2017), Tendo - Effect of Aging and Test Temperature on Adhesion Strength of Copper and
Epoxy Resin
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ICEP 2017 Proceedings, P09, pp.563-565 (2017), Tendo - Effect of High Temperature and Humidity Treatment on Adhesion Properties
and Bulk Properties of
Structural Adhesive
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
ICEP 2017 Proceedings, P08, pp.559-562 (2017), Tendo - Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature
Lead-free Solder and
Gold-plated Electrode
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
ICEP 2017 Proceedings, P06, pp.551-554 (2017), Tendo
- Effect of Metal Salt Generation Processing with Formic Acid on Solid State
Bonding Strength of A6061
Aluminum Alloy / SUS316L Stainless Steel
Hiroki Saito, Shigenori Ishikawa, Shigeki Tsuruoka ,Shinji Koyama, Ikuo Shohj
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.445-448 (2017), Yokohamai - Recrystallization Behaviors of (001)- and (111)-oriented Electrodeposited
Silver Films in Self-annealing
Process
Yumi Hayashi, Ikuo Syohji, Shinji Koyama, Hiroshi Miyazawa
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.439-440(2017), Yokohama - Investigation of the Effect of Rust Inhibitor in Brine on the Corrosion
Properties of Copper and Copper
Alloy Using an Electrochemical Measurement Method
Kazunari Higuchi, Ikuo Shohji, Shinji Koyama, Tetsuya Ando, Yoshikazu Mizutani, Yukio Inoue
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.419-424(2017), Yokohama - Optimization of Metal Salt Coating Conditions for Insert Metal and Its
Application to Solid-State Bonding of
Aluminum Casting alloy Interface
Shunya Saijo, Shinji Koyama, Ikuo Shohji
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.401-404(2017), Yokohama - Effect of Fracture Mode and Hydrolysis on Degradation of Adhesion Strength
of Structural Adhesive
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.227-230(2017), Yokohama - Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper
by Change
in Polymer-Bound under Aging
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.223-226(2017), Yokohama - A Study on the Formation Mechanism of Pillar-shaped Intermetallic Compound
Dispersed Lead-free
Solder Joint
Yusuke Nakata, Motoki Kurasawa, Tomihito Hashimoto, Yawara Hayashi, Ikuo Shohji
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.159-162(2017), Yokohama - Effect of Various Conditions on Formation of Lead-Free Solder Joint Dispersed
Pillar-Shaped
Intermetallic Compounds
Yawara Hayashi, Ikuo Shohji, Shinji Koyama, Yusuke Nakata, Tomohito Hashimoto
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.155-158(2017), Yokohama - Mechanical Properties of Sn-5Sb and Characteristic Change of its Joint
under Power Cycle Environment
Kyosuk Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.141-144(2017), Yokohama - Effect of Electrode Material on Microstructure and Joint Strength of Lead-free
Sn-57Bi-1Ag Solder
Joint
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.99-102(2017), Yokohama - Liquid Phase Diffusion Bonding of AC2C and ADC12 Aluminum Casting Alloy
by using Metal Salt Coated
Zn Sheet
Shunya Saijo, Shinji Koyama, Ikuo Shohji
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 063, pp.72 (2016), Kuala Lumpur, Malaysia - Fracture Behaviours of Miniature Size Specimens of Sn-5Sb Lead-free Solder
under Tensile and
Fatigue Conditions
Kyosuke Kobayasi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 062, pp.71 (2016), Kuala Lumpur, Malaysia
- Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper
Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani, Yukio Inoue
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 058, pp.69 (2016), Kuala Lumpur, Malaysia
- Degradation Behaviors of Adhesion Strength Between Epoxy Resin and Copper
under Aging at High
Temperature
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 057, pp.69 (2016), Kuala Lumpur, Malaysia
- Degrdation Behaviors of Adhesion Strength of Structual Adhesive for Weld-Bonding
under High
Temperature and Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 055, pp.68 (2016), Kuala Lumpur, Malaysia
- Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder
to Gold-Plated Copper
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 054, pp.67 (2016), Kuala Lumpur, Malaysia
- Change of Several Characteristics in Self-annealing of (001) Oriented Electrodeposited
Silver Films
Yumi Hayashi, Ikuo Shohji, Shinji Koyama, Hiroshi Miyazawa
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 053, pp.67 (2016), Kuala Lumpur, Malaysia - Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints
Dispersed Pillar Shaped
IMCS
Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomihito Hashimoto
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 052, pp.66 (2016), Kuala Lumpur, Malaysia
- ピラー状金属間化合物（ＩＭＣ）分散鉛フリーはんだ接合による高信頼性化検討
Yusuke Nakata, Motoki Kurasawa,Tomihito Hashimoto, Yawara Hayashi, Ikuo Shohji
Proc. of MES'16（Micro Electronics Symposium'16), Nagoya, pp..119-122 (2016) - パワーモジュール向けピラー状IMC分散鉛フリーはんだ接合部の開発
Yusuke Nakata, Tomohito Hashimoto, Yawara Hayashi, Ikuo Shohji
Proc. of 113th Committee of Microjoining (Japan Welding Society), pp.14-23 (2016), Tokyo - Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-free
Solder
Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono
Book of abstracts of THERMEC'2016, 516, pp.301 (2016), Graz, Austria - Comparison of Self-annealing Behaviors in (001)- and (111)-Oriented Electrodeposited
Silver Films by
In Situ EBSP Analysis
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Book of abstracts of THERMEC'2016, 369, pp.229 (2016), Graz, Austria
- Effect of Added Elements on Microstructures and Joint Strength of Lead-free
Sn-based Solder Joint
Dispersed IMC Pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto
Book of abstracts of THERMEC'2016, 367, pp.228 (2016), Graz, Austria
- Electrochemical Properties and Corrosion Behavior of SUS304 Brazed Joint
with Fe-based Filler
Takahiro Tsunoda, Kangdao Shi, Ikuo Shohji, Kotaro Matsu, Yasuhiro Taguchi
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.431-432(2016), Yokohama - In Situ Observation of Self-annealing Behavior of (001) Preferentially
Oriented Electrodeposited
Silver Film
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.405-408(2016), Yokohama - Thermal Stress Analysis of Assembled Substrate with Glass Interposer by
Finite Element Analysis
Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida, Kiyotomo Nakamura
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.395-400(2016), Yokohama - Development of IMC Pillar Dispersed Pb Free Solder Joint for Power Module
Yusuke Nakata, Tomohito Hashimoto, Yawara Hayashi, Ikuo Shohji
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.145-150(2016), Yokohama - Microstructure and Joint Strength of Lead-free Solder Joint Dispersed IMC
Pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.141-144(2016), Yokohama - Effect of Temperature on Fatigue Properties of Sn-5Sb Miniature Size Specimens
Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.53-56(2017), Yokohama - Effect of Load Coditions on Fatigue Properties of Low-Ag Lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In
Solder
Yuki Takahashi, IKuo Shohji
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.49-52(2016), Yokohama - Evaluation of self-annealing behavior of electrodeposited silver film by
EBSP analysis
Yumi Hayashi, Ikuo Shohji and Hiroshi Miyazawa
Proc. of 17th Electronics Packaging Technology Conference (EPTC), 141 (2015), Singapore - Development of high reliability lead-free solder joint dispersed IMC pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata and Tomihito Hashimoto
Proc. of 17th Electronics Packaging Technology Conference (EPTC), 139 (2015), Singapore - Effect of third element addition on joint strength of low-Ag lead-free
solder
Kyosuke Kobayashi, Ikuo Shohji and Mitsuo Yamashita
Proc. of 17th Electronics Packaging Technology Conference (EPTC), 138 (2015), Singapore - Fatigue Properties and Fatigue Crack Propagation Behavior of Low-Ag Lead-free
Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder
Yuki Takahashi and Ikuo Shohji
Program of InterPACK/ICNMM, pp.67 (2015), San Francisco, CA, USA - Tensile Properties and Microstructures of High Temperature Bi-based Lead-free
Solder
Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
Program of InterPACK/ICNMM, pp.67 (2015), San Francisco, CA, USA - Corrosion Behavior of SUS304 Brazed Joint with Fe-based Filler Alternative
to Ni-Based Filler
Takahiro Tsunoda, Ikuo Shohji, Kotaro Matsu, Kangdao Shi and Yasuhiro Taguchi
Program of InterPACK/ICNMM, pp.67 (2015), San Francisco, CA, USA - Thermal Stress Analysis of Mounted Substrate Using Glass Interposer
Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida and Kiyotomo Nakamura
Program of InterPACK/ICNMM, pp.61 (2015), San Francisco, CA, USA - Wettability of Epoxy Based Flux and Reinforcement Effect of Solder Ball
Joint
Akiyoshi Ishiyama, Ikuo Shohji, Tatsuya Ganbe, Hirohiko Watanabe
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp.415-416 (2015), Yokohama
- Effect of Fiber Content and Temperature on Mechanical Properties of Short
Fiber-Reinforced PPS
Ryogo Takahashi, Ikuo Shohji, Yuki Seki, Satoshi Maruyama
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp.413-414 (2015), Yokohama
- Effect of Coupling Agent on Adhesion and Fatigue Properties of Underfill
Materials for Flip Chip Bonding
Hironao Mitsugi, Ikuo Shohji, Shinji Koyama
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp.411-412 (2015), Yokohama - Effect of Difference in CTE between Glass and Organic Circuit Boards on
Joint Reliability
Tetsuyuki Tsuchida, Kiyotomo Nakamura, Yuto Kubota, Ikuo Shohji
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp. 407-408 (2015), Yokohama
- Microstructure and Corrosion Resistance of SUS304 Brazed Joint with Fe-based
Filler Alternative to
Ni-based Filler
Takahiro Tsunoda, Ikuo Shohji, Shikang Dao, Kotaro Matsu, Yasihiro Taguchi
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp. 387-390 (2015), Yokohama - Effect of Temperature and Strain Rate on Tensile Properties of High Temperature
Bi-based Lead-free
Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda, Hirohiko Watanabe
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp. 177-180 (2015), Yokohama - Fatigue Properties of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Low-silver Lead-free Solder
Yuki Takahashi, Ikuo Shohji
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp. 165-168 (2015), Yokohama - Thermal Stress Analysis of Lead-free Solder Joints using a Glass Interposer
Substrate
Yuto Kubota, Ikuo Syohji, Tetsuyuki Tsuchida, Kiyotomo Nakamura
Mate 2015(Microjoining and Assembly Technology in Electronics) Proc. pp. 29-32 (2015), Yokohama - Tensile Properties of Low-melting Point Sn-Bi-Sb Solder
Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida and Kiyotomo Nakamura
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 788-792 (2014), Singapore
- Joint Strength and Microstructures of Brazed Joints of Stainless Steel
with Fe-based Filler
Takahiro Tsunoda, Kangdao Shi, Ikuo Shohji, Kotaro Matsu and Yasuhiro Taguchi
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 855-858 (2014), Singapore
- Mechanical Properties of Low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder
Yuki Takahashi and Ikuo Shohji
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp.784-787 (2014), Singapore
- Effect of Temperature on Tensile Properties of High-melting Point Bi System
Solder
Haidong Zhang, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp.780-783 (2014), Singapore
- Effect of Fiber Direction and Temperature on Fatigue Behaviors of ShortFiber-Reinforced PPS
Ryogo Takahashi, Ikuo Shohji, Yuki Seki and Satoshi Maruyama
Final Program of MS&T14, pp. 125 (2014), Pittsburgh, Pennsylvania, USA
- Improvement Effect of Joint Reliability of Sn-3Ag-0.5Cu Solder Ball Joint
with Epoxy-based Flux
Akiyoshi Ishiyama, Ikuo Shohji, Tatsuya Ganbe and Hirohiko Watanabe
Final Program of MS&T14, pp. 125 (2014), Pittsburgh, Pennsylvania, USA
- Effect of Coupling Treatment of Filler and Copper Substrate on Adhesion
of Underfill
Hironao Mitsugi, Ikuo Shohji and Shinji Koyama
Final Program of MS&T14, pp. 125 (2014), Pittsburgh, Pennsylvania, USA
- Effect of Fiber Direction and Temperature on Mechanical Properties of Short
Fiber-Reinforced PPS
R. Takahashi, I. Shohji, Y. Seki and S. Maruyama
Proc. of ICEP 2014 (CD-ROM), pp.778-781 (2014), Toyama - Effect of Coupling Agent on Adhesion of Underfill on Copper
H. Mitsugi, I. Shohji, S. Koyama and S. Kitagoh
Proc. of ICEP 2014 (CD-ROM), pp.774-777 (2014), Toyama - Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux
A. Ishiyama, I. Shohji, T. Ganbe and H. Watanabe
Proc. of ICEP 2014 (CD-ROM), pp.766-769 (2014), Toyama - Interfacial Reaction of Molten Sn and Plasma Nitrided Stainless Steel
Shingo Hattori, Ikuo Shohji and Hideyuki Kuwahara
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.397-398 (2014), Yokohama
- Relaxation of Solid-State Bonding Condition of Al Alloy/SUS304 by Metal
Salt Generation Bonding
Technique with Acetic Acid
Kota Matsubara, Shinji Koyama and Ikuo Shohji
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.389-390 (2014), Yokohama
- Relaxation of Solid-State Bonding Condition of Cu/Cu bu Metal Salt Generation
Bonding Technique
Naoki Hagiwara, Shinji Koyama and Ikuo Shohji
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.387-388 (2014), Yokohama
- Age Hardening and Microstructures of High Al Content Mg Alloys
Tsukasa Akiyama, Ikuo Shohji, Shinji Koyama, Shinichi Nishida, Hisaki Watari and Keisuke Fujikura
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.373-376 (2014), Yokohama
- Effect of Fiber Direction and Temperature on Mechanical Properties of Short
Fiber-Reinforced Resin
Material
Ryogo Taskahashi, Ikuo Shohji, Yuki Seki and Satoshi Maruyama
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.369-372 (2014), Yokohama
- Effect of Additives on Fatigue Properties of Electrolytic Copper Foil for
Lithium Ion Rechargeable Battery
Takuya Nagayama, Ikuo Shohji, Teizo Nishi and Yuan Yuan Wu
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.357-360 (2014), Yokohama
- Structure of Sn-W at the Interface between Sn-3Ag-0.5Cu Solder and Ni-B
Metallization on
W Substrate
Chiko Yorita, Masahide Harada, Toru Nishikawa, Tatsuya Kobayashi and Ikuo Shohji
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.291-296(2014), Yokohama
- Effect of Coupling Agent on Mechanical Properties of Underfill for Flip
Chip Bonding
Hironao Mitsugi, Ikuo Shohji, Shinji Koyama and Shinya Kitagoh
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.279-282 (2014), Yokohama
- Improvement Effect of Impact Properties of Solder Ball Joint with Epoxy-Based
Flux
Akiyoshi Ishiyama, Ikuo Shohji, Tatsuya Ganbe and Hirohiko Watanabe
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.251-254 (2014), Yokohama
- Effect of Aging on Joining Properties of Sb, Zn-Added Sn-Bi Based Solder
and Electroless Ni/Au and
Ni/Pd/Au Electrodes
Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.51-54 (2014), Yokohama
- Change of Characterization in Electroless Plating Ni-B Alloy Films by Heat
Treatment
Chiko Yorita, Takayoshi Watanabe, Hiroshi Kikuchi1, Toru Nishikawa, Masahide Harada and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.675-676 (2013), Las Vegas, USA
- Effect of Strain Rate on Tensile Properties of Miniature Size Specimens
of Several Lead-free Alloys
(invited)
Ikuo Shohji and Yuichiro Toyama
Book of Abstracts of THERMEC’2013, pp.558-559 (2013), Las Vegas, USA
- Effect of the contents of Se in high-cyanide silver plating solution on
200 orientation of the silver
electro-deposited layer
Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.421-422 (2013), Las Vegas, USA
- Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding
Technique with Acetic Acid
Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.396-397 (2013), Las Vegas, USA
- Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with
Formic Acid and Citric Acid
Naoki Hagiwara, Shinji Koyama and Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.216 (2013), Las Vegas, USA
- Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with
Fine Diameter Specimens
Takashi Hisada, Ikuo Shohji, Yasuharu Yamada, Kazushige Toriyama and Mamoru Ueno
Proc. of IEEE CPMT Symposium Japan 2013, pp.205-208 (2013), Kyoto
- Effect of Filler Addition and Thermal Aging on Tensile Properties of Underfill
Material
Hironao Mitsugi，Shinya Kitagoh，Ikuo Shohji and Shinji Koyama
Proc. of 3rd Committee of Electronics Device Packaging (Smart Processing Society), pp. 37-44 (2013), Osaka
- Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic
Copper Foil
Takuya Nagayama, Hiroaki Yoshida and Ikuo Shohji
Proc. of InterPACK2013 (CD-ROM), IPACK2013-73172 (2013), Burlingame, California, USA
- Effect of Electrode Material on Joint Strength of Soldered Joints with
Sn-Bi and Sn-Bi-Sb Lead-free
Solder Balls
Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo
Proc. of InterPACK2013 (CD-ROM), IPACK2013-73171 (2013), Burlingame, California, USA
- Interfacial Reaction between Molten Sn and Plasma Nitrided Stainless Steel
Shingho Hattori, Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara
Proc. of InterPACK2013 (CD-ROM), IPACK2013-73170 (2013), Burlingame, California, USA
- Effects of Microstructure and Strain Rate on Tensile Properties of Miniature
Size Specimens of Lead-free
Solder
Yuichiro Toyama and Ikuo Shohji
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc. pp.459-460 (2013), Yokohama
- Effect of Additives on Mechanical Properties of Electrolytic Copper Foil
for Lithium Ion Rechargeable
Battery
Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji, Teizo Nishi and Yuan Yuan Wu
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc. pp.341-344 (2013), Yokohama
- Effect of Temperature on Erosion Behavior of Plasma Nitrided Stainless
Steel
Shingo Hattori, Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc. pp.287-290 (2013), Yokohama - Joining Properties of Sn-Bi Lead-free Solder Balls and Electroless Ni/Au
and Ni/Pd/Au Electrodes
Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tuchida and Toshikazu Ookubo
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc. pp.231-234 (2013), Yokohama
- Effect of Temperature and Filler Additive Amount on Material Properties
of Underfill for Flip Chip Boning
Shinya Kitagoh, Hironao Mitsugi, Ikuo Shohji and Shinji Koyama
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc. pp.171-176 (2013), Yokohama
- A Study of Bonding Strength of Al/Cu by Metal Salt Generation Bonding Method
S. K. Ting, Hirokazu Hata, Shinji Koyama and Ikuo Shohji
Proc. of Visual-JW2012, pp. 192-193, (2012), Osaka
- A Study of Solid State Bonding Strength of Al/Cu by Using Metal Salt Generation
Bonding Method on Al
Surface
Shinji Koyama, S. K. Ting, Ikuo Shohji, Hirokazu Hata, Naoki Hagiwara and Kota Matsubara
Proc. of Visual-JW2012, pp. 167-168, (2012), Osaka - Effect of Strain Rate on Tensile Properties of Miniature Size Lead-Free
Alloys
Yuichiro Toyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P151, (2012), Ipoh, Malaysia
- Effect of Filler Content on Tensile Properties of Underfill Material for
Flip Chip Bonding
Shinya Kitagoh, Hironao Mitsugi, Shinji Koyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P150, (2012), Ipoh, Malaysia
- Effect of Surface Modification by Citric Acid on Fluxless Vacuum Bonding
of Cu with Sn-Cu Alloy
Masumi Hayakawa, Shinji Koyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P149, (2012), Ipoh, Malaysia
- Effect of Ni, Ge and P Addition in Sn-Ag-Cu Lead-free Solder on Solder
Joint Properties with Electroless
Ni/Au Electrodes
Ikuo Shohji and Ryohei Arai
Proc. of IEMT 2012, IEMT2012-P032, (2012), Ipoh, Malaysia
- Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder
Ball
Maryam Husna Yahya, Keisuke Nakamura, Ikuo Shohji, Toshihiro Housen, Yumi Yamamoto and Yoshio Kaga
Proc. of IEMT 2012, IEMT2012-P031, (2012), Ipoh, Malaysia
- The Influence of Additives in Lead-free Electroless Nickel Plating Film
on the Reliability of Solder Joint
Tetsuyuki Tsuchida, Toshikazu Okubo, Takahiro Kano and Ikuo Shohji
MES 2012(Micro Electronics Symposium) Proc. pp.141-144 (2012), Osaka
- Development of Wettability Evaluation Equipment for Solder Paste and Suggestion
its Method
Kiyoshi Hiramoto, Masashi Nishimuro, Shinji Koyama, Ikuo Shohji and Hironaga Miyamoto
Proc. of 53rd Sodering Sectional Committee (Committee of Microjoining, Japan Welding Society), pp.27-38 (2012),
Tokyo
- Effect of Substrate Material on Thermal Fatigue Life of Solder Joint of
WLCSP
S. Kitagoh, I. Shohji, M. Miyazaki, J. Watanabe, K. Hatsuzawa
Proc. of ICEP-IAAC 2012 (CD-ROM), pp. 693-696 (2012), Tokyo
- Investigation of Impact Properties of Lead-free Solders using Micro-size
Specimens
Y. Toyama, I. Shohji
Proc. of ICEP-IAAC 2012 (CD-ROM), pp. 669-672 (2012), Tokyo - Microstructures and Joint Strength of Vacuum Jointed Cu with Sn-Cu Alloys
M. Hayakawa, I. Shohji, S. Koyama, H. Nara, N. Otomo, M. Uenishi
Proc. of ICEP-IAAC 2012 (CD-ROM), pp. 661-664 (2012), Tokyo
- Mounting technology trends in lead-free solder(Keynote)
Ikuo Shohji
Proc. of the symposium on the impact of lead-free for solder materials, (2012), Tokyo
- Joint Properties of Electroless Ni/Au and Ni/Pd/Au Electrodes Fabricated
with Lead-free Plating Bath
Takahiro Kano, Ikuo Shohji, Tetsuyuki Tuchida and Toshikazu Ookubo
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.439-440 (2012), Yokohama
- Effect of Additions of Au, Pd, Bi on Tensile Properties of Eutectic Sn-Pb
Miniature Size Specimens
Ryou kikuchi, Ikuo Shohji, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara and Fusao Iwase
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.433-434 (2012), Yokohama
- Effect of Substrate Material on Thermal Fatigue Life of WLCSP Solder Joint
Shinya Kitagoh, Ikuo Shohji, Makoto Miyazaki, Jun Watanabe and Kenji Hatsuzawa
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.377-380 (2012), Yokohama
- Microstructures and Joint Strength of Soldered Cu Joint with Sn-Cu Lead-Free
Alloys in Vacuum
Masumi Hayakawa, Ikuo Shohji, Shinji Koyama, Hideaki Nara, Noboru Otomo and Masahisa Uenishi
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.85-88 (2012), Yokohama
- Tensile Properties of Miniature Size Lead-free Solder Specimens at High
Strain Rate
Yuichiro Toyama and Ikuo Shohji
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.65-68 (2012), Yokohama
- The Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating
against Lead-Free
Solder
Jun Watanabe, Norihisa Sekimori, Kenji Hatsuzawa, Takashi Uetani and Ikuo Shohji
Proceedings of ECO-MATES 2011, Vol.2, pp.47-48 (2011), Osaka
- Low Temperature of Sn/Cu Solid-State Bonding by Metal Salt Generation Bonding
Technique
Yukinari Aoki, Shinji Koyama and Ikuo Shohji
Proc. of 52nd Sodering Sectional Committee (Committee of Microjoining, Japan Welding Society), pp.65-70 (2011),
Tokyo
- The Influence of Lead and Sulfur Contained in Electroless Nickel Plating
Film on the Reliability of Solder
Joint with the Electroless Ni/Pd/Au Plating
Tetsuyuki Tsuchida, Toshikazu Ookubo, Takahiro Kano and Ikuo Shohji
MES 2011(Micro Electronics Symposium) Proc. pp.145-148 (2011), Osaka
- Effect of the Organic Acid Surface Modification on Bond Strength of Tin
and Copper
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52072 (2011), Portland, USA
- Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu
Lead-Free Solder
Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52026 (2011), Portland, USA
- Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb
Solder With Small Amounts
of Au and Pd for Aerospace Application
Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara and Fusao Iwase
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52025 (2011)
- Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free
Solder Ball Joint With Electroless
Ni/Pd/Au Plated Electrode
Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52024 (2011), Portland, USA
- Erosion Behavior of Plasma Nitriding Stainless Steel
Naoya Matsubara, Kazuhito Sumiyoshi, Ikuo Shohji and Hideyuki Kuwahara
Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.359-360 (2011), Yokohama
- The Study of High Thermal Conductivity Underfill Material Including MWCNT
Jun Watanabe, Makoto Miyazaki, Kenji Hatsuzawa and Ikuo Shohji
Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.353-354 (2011), Yokohama
- Effect of Thickness of Pd Plating on Joint Properties of Electroless Ni/Pd/Au
Plated Electrode and
Leasd-free Solder
Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo
Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.333-334 (2011), Yokohama
- Effect of Aging on Tensile Properties of Eutectic Sn-Pb Solder with Small
Amount of Au and Pd
Ryou Kikuchi, Yuuta Saitou, Ikuo Shohji, Norio Negishi, Tsuyoshi Nakagawa, Nobuaki Ebihara an Fusao Iwase
Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.331-332 (2011), Yokohama
- Influence of Properties of Raw PW-board on Reliabilities for Aseembled
PW-boards
Makoto Miyazaki, Jun Watanabe, Kenji Hatsuzawa, Shinya Kitagou and Ikuo Shohji
Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.159-164 (2011), Yokohama
- Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test
under high strain rate
(Invited Lecture)
Kiyokazu Yasuda, Yoshihiro Sakin, Ikuo Shohji and Tadashi Takemoto
Proc. of Visual-JW 2010, Vol. 2, p.29-30 (2010), Osaka
- Examination of improvement effect of surface modification of Cu with organic
acid on solder paste
wettability using a laser displacement meter
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Proc. of Visual-JW 2010, Vol. 1, p.193-194 (2010), Osaka - Development of wettability evaluation equipment for solder paste using
laser displacement method
Shinji Koyama, Issei Oya, Toshihiro Isaka, Ikuo Shohji, Masashi Nishimuro, Kiyoshi Hiramoto and Hironaga Miyamoto
Proc. of Visual-JW 2010, Vol. 1, p.191-192 (2010), Osaka - 錫の酸化皮膜に対する有機酸の改質作用と固相接合強度への影響
Shinji Koyama, Ikuo Shohji
Proc. of 95th Committee of Microjoining (Japan Welding Society),pp.55-62 (2010), Tokyo
- The effect of the additives in nickel plating film on the reliability of
solder joint with the electroless
Ni-P/Au and Ni-P/Pd/Au plating
Tetsuyuki Tsuchida, Toshikazu Ookubo, Takahiro Kano, Ikuo Shohji
MES 2010(Micro Electronics Symposium) Proc. pp.95-98 (2010), Kyoto
- Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue
Life for Chip Size Package
Solder Joints
Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.98 (2010), Kuala Lumpur, Malaysia
- Effect of interfacial reaction on joint strength of semiconductor metallization
and Sn-3Ag-0.5Cu solder
ball
Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.47 (2010), Kuala Lumpur, Malaysia
- Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge
Solder Alloy
Hirohiko Watanabe, Masayoshi Shimoda, Noboru Hidaka and Ikuo Shohji
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.29 (2010), Kuala Lumpur, Malaysia
- Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge
Alloy
Ikuo Shohji, Ryohei Arai, Hisao Ishikawa and Masao Kojima
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.23 (2010), Kuala Lumpur, Malaysia
- Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge
Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa and Ikuo Shohji
Book of Abstracts Far East and Oceanic Fracture Society 2010, p.23 (2010), Kuala Lumpur, Malaysia
- Effect of Ni Content on Dissolution Properties of Ci into Sn-Ag-Cu-Ni-Ge
Solder
M. Nagai, H. Watanabe, T. Osawa and I. Shohji
Mate 2010(Microjoining and Assembly Technology in Electronics) Proc. pp.225-228 (2010), Yokohama
- Effect of Ag Content on Strength of Sn-Ag-Cu-Ni-Ge Alloy
R. Arai, I. Shohji, H. Ishikawa and M. Kojima
Mate 2010(Microjoining and Assembly Technology in Electronics) Proc. pp.147-150 (2010), Yokohama
- Interfacial Reaction between Metallization for Semiconductor Electrode
and Sn-3Ag-0.5Cu Solder
T. Kobayashi, I. Shohji and C. Yorita
Mate 2010(Microjoining and Assembly Technology in Electronics) Proc. pp.27-30 (2010), Yokohama
- Development of Joining Technology of Al Alloy Plate and Cu Alloy Pipe for
Cooling System of Power
Module
I. Oshiro, I. Shohji, H. Nara, N. Otomo and M. Uenishi
Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.951-954 (2009), Kyoto
- Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb
Solder for Aerospace
Application
Y. Saitoh, I. Shohji, N. Nemoto, T. Nakagawa, N. Ebihara and F. Iwase
Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.947-950 (2009), Kyoto
- Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten
Sn-3Ag-0.5Cu Solder
K. Sumiyoshi, I. Shohji and M. Miyazaki
Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.943-946 (2009), Kyoto
- Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten
Lead-free Solder
Kazuhito Sumiyoshi, Ikuo Shohji, Hiroyuki Takase and Makoto Miyazaki
Mate 2009(Microjoining and Assembly Technology in Electronics) Proc. pp.395-398 (2009), Yokohama
- The Effects of Ag, Ni, and Ge Elements in Lead-free Sn Base Solder Alloy
Mitsuo Yamashita, Noboru Hidaka and Ikuo Shohji
Proc. of Electronics Packaging Technology Conference 2008, pp.582-587 (2008), Singapore
- Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
Pacific Rim Meeting on Electrochemical and Solid-State Science, Abs. 0090 (2008), Honolulu, Hawaii, USA - Sn基鉛フリーはんだのソルダリング特性に及ぼすAg, Ni, Ge添加の影響
Mitsuo Yamashita, Noboru Hidaka, Ikuo Shohji
Proc. of 46rd Sodering Sectional Committee (Committee of Microjoining, Japan Welding Society), pp.57-60(2008),
Tokyo
- Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint
Ikuo Shohji, Tsutomu Osawa, Takeshi Okashita and Hirohiko Watanabe
Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage
Mechanics(FDM 2008), pp.745-748 (2008), Seoul, Korea
- Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size
Package Solder Joint
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano
Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.433-436 (2008), Seoul, Korea
- Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder
Ball Joints
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.429-432 (2008), Seoul, Korea
- Effect of Materials Properties of Underfill Materials on Thermal Fatigue
Life of Chip Size Package Solder
Joints
Tomotake Tohei, Keisuke Yoshizawa, Ikuo Shohji, Masaharu Nishimoto, Yasushi Ogawa, Takayuki Kawano,
Yumiko Mizutani and Yoshihiko Ohsaki
Mate 2008(Microjoining and Assembly Technology in Electronics) Proc. pp.267-270 (2008), Yokohama
- Tensile Properties of Several Lead-free Solders Evaluated by Micro Size
Specimens
Tsutomo Osawa, Ikuo Shohji, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto
Mate 2008(Microjoining and Assembly Technology in Electronics) Proc. pp.115-118 (2008), Yokohama
- Influence of Reaction Layer Formation in the Solder Joint of Sn-Ag-Cu-Ni-Ge
Alloys
Hirohiko Watanabe, Masayoshi Shimoda, Ikuo Shohji and Tsutomo Osawa
Mate 2008(Microjoining and Assembly Technology in Electronics) Proc. pp.83-88 (2008), Yokohama
- Electroless Ni/Au Plated Electrode under HIgh Temperature Storage Conditions
Satoshi Shimoyama, Ikuo Shohji, Hisao Ishikawa and Masao Kojima
Mate 2008(Microjoining and Assembly Technology in Electronics) Proc. pp.75-78 (2008), Yokohama
- Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package
Solder Joints
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano
Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.112 (2007)
- Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn
Solder Joints on Electroless
Ni/Au Plated Electrodes
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.110 (2007)
- Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders
Evaluated by Micro Size
Specimens
Ikuo Shohji, Tsutomo Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto
Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.109 (2007)
- Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu
Lead-Free Solders Using Strain
Rate Sensitivity Index
Kiyokazu Yasuda, Ikuo Shohji and Tadashi Takemoto
Abstract Book IWJC-Korea 2007 (International Welding and Joining Conference-Korea 2007) pp. 94-95 (2007)
- Low-Cycle Fatigue Damage Evaluation by Surface Deformation for Sn-Ag Based
Lead-Free Solders
Takehiko Takahashi，Susumu Hioki，Ikuo Shohji and Osamu Kamiya
Mate 2007(Microjoining and Assembly Technology in Electronics) Proc. pp.227-232(2007), Yokohama
- Influence of Content of Ni and Ag on Microstructure and Joint Strength
of Lead-Free Solder Joint with
Sn-Ag-Cu-Ni-Ge
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe and Tatsuhiko Asai
Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.293 (2006)
- Influence of Properties of Underfill Materials on Thermal Stress Relief
in Lead-Free Solder Joint of Chip
Size Package
Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano
Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.292 (2006)
- Development of Cu Brazing Sheet with Cu-P Composite Plating
Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo and Masahisa Uenishi
Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.292 (2006)
- Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge
Lead-Free Solder
Hirohiko Watanabe, Noboru Hidata, Ikuo Shohji and Mototaka Ito
Proceedings of Materials Science and Technology (MS&T) 2006: PRODUCT MANUFATURING, pp.135-146 (2006)
- Microstructure and Joint Strength of Sn-Ag-Cu-Ni-Ge Lead-free Solder Joint
Ikuo Shohji，Satoshi Tsunoda，Hirohiko Watanabe，Tatsuhiko Asai
Proc. of 41st Sodering Sectional Committee (Committee of Microjoining, Japan Welding Society), Tokyo, pp.1-11 (2006)
- New Lead Free Solder Composition and Physical Properties of Printed Wiring
Board Laminate Material
To Suppress Lift-Off and Improve Reliability
Kenichi Ikeda, Hideki Ishihara, Hirohiko Watanabe, Tatsuhiko Asai, Hiroaki Hokazono and Ikuo Shohji
Proceedings of IPC Printed Circuits Expo, APEX and the Designers Summit 2006, S39-02 (2006)
- Influence of Addition Volume of Ni on Microstructure and Joint Strength
in Soldered Joint with Sn-Ag-Cu-Ni-Ge Lead-free Alloy
Satoshi Tsunoda，Ikuo Shohji，Hirohiko Watanabe，Tatsuhiko Asai
Mate 2006(Microjoining and Assembly Technology in Electronics) Proc. pp.279-284 (2006)
- Influence of Properties of Underfill Materials on Thermal Stress Relief
in Solder Joint for Chip Size
Package
Keisuke Yoshizawa，Ikuo Shohji，Masaharu Nishimoto，Takayuki Kawano
Mate 2006(Microjoining and Assembly Technology in Electronics) Proc. pp.275-278 (2006)
- Low-Cycle Fatigue Property Evaluation for Sn-3.5Ag and Sn-0.7Cu Lead-free
Solders Using Surface
Deformation
Takehiko Takahashi，Susumu Hioki，Ikuo Shohji，Osamu Kamiya
Mate 2006(Microjoining and Assembly Technology in Electronics) Proc. pp.253-258 (2006) - Whisker-Restrained Pb-Free Solder Paste
Yoshitou Hayashida，Yoshiyuki Takahashi，Takao Ohno，Ikuo Shohji
Mate 2006(Microjoining and Assembly Technology in Electronics) Proc. pp.39-44 (2006)
- Thermal stress relief in lead-free solder joint for chip size package with
encapsulant materials
Ikuo Shohji, Keisuke Yosizawa, Masaharu Mishimoto and Takayuki Kawano
Program & Abstract of International Symposium on Smart Processing Technology, p.26 (2005)
- Whisker-Restrained Pb-Free Solder
Yoshitou Hayashida，Yoshiyuki Takahashi，Takao Ohno，Ikuo Shohji
MES 2005(Micro Electronics Symposium) Proc. pp.273-276 (2005)
- An Evaluation of Fatigue Damage in Low-cycle Range for Sn-3.5Ag, Sn-0.7Cu
Lead-free Solders and
Sn-Pb Eutectic Solder Using Image Processing to Surface Feature
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Proceedings of IPACK2005 (CD-ROM), IPACK2005-73152, (2005)
- Comparison of Immersion Gold Plating in Reliability of a Lead-Free Solder
Joint with Autocatalytic
Electroless Gold Plating
Kiyotomo Nakamura, Ikuo Shohji, Hiroki Goto, and Toshikazu Ookubo
Proceedings of the 7th International Conference on Ecomaterials, pp.347-353 (2005)
- Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free
Solder Joint
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Proceedings of the 7th International Conference on Ecomaterials, pp.309-315 (2005)
- Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat
Exposure Conditions
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe,Tatsuhiko Asai and Megumi Nagano
Proceedings of the 7th International Conference on Ecomaterials, pp.248-254 (2005)
- Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu
Lead-free Solder
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Proceedings of the 6th International Conference on Fracture and Strength of Solids Part 1, pp.120-125 (2005)
- Ultrasonic Bonding of an Aluminum Foil with a Dielectric Layer and a Palladium
Electrode
Tsukasa Sakurai，Ikuo Shohji and Masashi Oshima
Proc. of Mate 2005(Microjoining and Assembly Technology in Electronics), pp.395-398 (2005)
- New Pb-free Solder Composition and Physical Properties of Printed Wiring
Board Laminate Material for
Suppressing Lift-off Phenomena
Kenichi Ikeda，Hideki Ishihara，Hirohiko Watanabe，Tatsuhiko Asai，Hiroaki Hokazono and Ikuo Shohji
Proc. of Mate 2005(Microjoining and Assembly Technology in Electronics), pp.343-348 (2005)
- Low Cycle Fatigue Properties and Surface Feature by an Image Processing
of Sn-0.7Cu Lead-free Solder
Tekehiko Takahashi，Susumu Hioki，Ikuo Shohji and Osamu Kamiya
Proc. of Mate 2005(Microjoining and Assembly Technology in Electronics), pp.297-302 (2005)
- Influence of an Immersion and Autocatalytic Electroless Gold Plating Layer
on Reliability of a Lead-free
Solder Joint
Hiroki Goto，Ikuo Shohji，Kiyotomo Nakamura and Toshikazu OOkubo
Proc. of Mate 2005(Microjoining and Assembly Technology in Electronics), pp.183-188 (2005)
- Joint Strength and Microstructure of microjoint with Sn-Ag-In-Bi Lead-free
Solder
Ikuo Shohji and Hitoshi Ninomiya
Proceedings of New Frontiers of Process Science and Engineering in Advanced Materials '04, pp.227-232 (2004)
- Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure
of Solder Joint with
Sn-3Ag-0.5Cu
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, pp.421 (2004)
- High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic
Bonding for
High-Frequency Chip Coil
Ikuo Shohji, Tsukasa Sakurai and Shinji Arai
Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, pp.416 (2004)
- Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base
Filler Metals Added Cr
Powder
Ikuo Shohji, Satoshi Takayama, Takanori Nakazawa, Ken Matsumoto and Masanori Hikita
Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, pp.212 (2004)
- Mechanical Properties of Various Lead-free Solders
Takehiko Takahashi, Susumu Hioki, Osamu Kamiya and Ikuo Shohji
Proc. of The 2nd International Conference on Structure, Processing and Properties of Materials, SPPM2004, pp.778-785
(2004)
- Development of High Speed Bonding Technology for High-frequency Chip Coils
Ikuo Shohji, Shinji Arai, Tsukasa Sakurai, Hiroyuki Kumehara, Keiji Usunami, Yoshitaka Kimura and Takashi Susai
Proc. of Mate 2004(Microjoining and Assembly Technology in Electronics), Yokohama, pp.231-236 (2004)
- Tensile Properties of Sn-0.7mass%Cu Lead-free Solder
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Abstracts 2 of The 8th IUMRS International Conference on Advanced Materials 2003, Yokohama, pp.38 (2003)
- Effect of Ni Coating over Cu Ball on the Microstructure of Flip Chip Joints
with Cu-corred Solder Balls
Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira Ichida
Proc. of InterPACK03(CD-ROM), Maui, InterPack2003-35120 (2003)
- Mechanical Properties of Low-melting Lead-free Solders
Shohji Ikuo, Yoshida Tomohiro, Takahashi Takehiko and Hioki Susumuo
Proc. of Mate 2003(Microjoining and Assembly Technology in Electronics), Yokohama, pp.229-234 (2003)
- Mechanical Properties of Various Lead-free Solders
Takahashi Takehiko, Hioki Susumu, Shohji Ikuo and Yoshida Tomohiro
Proc. of Mate 2003(Microjoining and Assembly Technology in Electronics), Yokohama, pp.223-228 (2003)
- Method of Testing Mechanical Properties of Solders
Ikuo Shohji and Susumu Hioki
Proc. of 67th Committee of Microjoining (Japan Welding Society), Tokyo, pp.13-28 (2002)
- Microstructures and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
Shohji Ikuo, Nakamura Takao, Mori Fuminari and Fujiuchi Shinichi
Proc. of Mate 2002(Microjoining and Assembly Technology in Electronics), Yokohama, pp.289-294 (2002)
- Brazing of Stainless Steel with CuP Filler
Shohji Ikuo, Fujihira Mitsuhiro, Nakazawa Takanori, Uenishi Masahisa and Otomo Noboru
Proc. of 2001 International Brazing & Soldering Conference, Yangzhong, pp.83-88 (2001)
- Thermal Fatigue Behavior of CSP Solder Joints with Sn-Ag Lead-free Solders
under Thermal Cycle
Conditions
Ikuo Shohji, Fuminari Mori, Shinichi Fujiuchi and Masaru Yamashita
Proc. of 2001 International Conference on Electronics Packaging, Tokyo, pp.296-301 (2001)
- Evaluation of Thermal Fatigue Strength of Flip Chip Joints with Electroless
Ni Bump and Sn-Ag Lead-Free
Solders
Ikuo Shohji, Fuminari Mori
Proc. of Mate 2001(Microjoining and Assembly Technology in Electronics), Yokohama, pp.101-106 (2001)
- Thermal Fatigue Microstructures of CSP Solder Joints with Lead-free Sn-Ag
Alloys
Ikuo Shohji, Fuminari Mori, Shinichi Fujiuchi and Masaru Yamashita
Proc. of 67th Committee of Microjoining (Japan Welding Society), Tokyo, pp.33-42 (2000)
- Effect of Cu Core on BGA Joint Microstructure Using Sn-Ag
Toshio Saeki, Keisuke Uenishi, Kojiro F. Kobayashi, Ikuo Shohji and Masaharu Yamamoto
Proc. of Mate 2000(Microjoining and Assembly Technology in Electronics), Yokohama, pp.255-260 (2000)
- Evaluation of The Microstructure and The Thermal Fatigue Strength of CSP
Solder Joints with Sn-Ag
Lead-Free Solders
Ikuo Shohji and Masaru Yamashita
Proc. of Mate 2000(Microjoining and Assembly Technology in Electronics), Yokohama, pp.223-228 (2000)
- Development of Flip Chip Rework Method with Solder Capped Chip by Paste
Printing
Fuminari Mori, Kazushige Toriyama, Naoki Katsu and Ikuo Shohji
Proc. of Mate 2000(Microjoining and Assembly Technology in Electronics), Yokohama, pp.143-146 (2000)
- Microstructure and Mechanical Property of BGA Joint with Cu Cored Solder
Ball - The Second Report -
Shinya Kiyono, Toshio Saeki, Keisuke Uenishi, Kojiro F. Kobayashi, Ikuo Shohji and Masaharu Yamamoto
Proc. of Mate 2000(Microjoining and Assembly Technology in Electronics), Yokohama, pp.125-130 (2000)
- Growth Kinetics of Intermetallic Compounds on The Boundary between Au and
In-Sn Solder
Shinichi Fujiwara, Kojiro F. Kobayashi, Ikuo Shohji and Toshio Fujii
Proc. of Mate'99(Microjoining and Assembly Technology in Electronics),Yokohama, pp.427-432 (1999)
- Thermal Fatigue Strength Evaluation of 0.5 mm Pitch CSP Solder Joints
IKuo Shohji, Hideo Mori and Yasumitsu Orii
Proc. of Mate'99(Microjoining and Assembly Technology in Electronics), Yokohama, pp.137-142 (1999)
- Microstructure and Mechanical Property of BGA Joint with Cu Cored Solder
Ball
Shinya Kiyono, Keisuke Uenishi, Ikuo Shohji, Masaharu Yamamoto and Kojiro F. Kobayashi
Proc. of Mate'99(Microjoining and Assembly Technology in Electronics), Yokohama, pp.115-120 (1999)
- Reliability of Solder Joints of BGA/CSP
Masanori Takushima, Yasumitsu Orii, Ikuo Shohji and Kazushige Toriyama
Proc. of 56th Committee of Microjoining (Japan Welding Society), Tokyo, pp.1-8 (1998)
- Relation between Shear Properties of Solders for Flip Chip Joints and Thermal
Fatigue Strength
Ikuo Shohji, Yasumitsu Orii and Kojiro F. Kobayashi
Proc. of Mate'98(Microjoining and Assembly Technology in Electronics), Yokohama, pp.199-204 (1998)
- Reliabilities of Several Solders for Flip Chip Bonding
Ikuo Shohji, Yasumitsu Orii, Kojiro F. Kobayashi
Proc. of 23rd Sodering Sectional Committee (Committee of Microjoining, Japan Welding Society), Tokyo, pp.47-58
(1997)
- Thermal Fatigue Behavior of Flip Chip Joint and Shear Creep Property
Ikuo Shohji, Ysumitsu Orii and Kojiro F. Kobayashi
Proc. of Mate'97(Microjoining and Assembly Technology in Electronics), Yokohama, pp.185-190 (1997)
- Packaging Technology for Fine Pitch Flip Chip Attach with Chips Designed
for Wire Bonding Connection
Ikuo Shohji, Takeshi Yamada, Hideo Kimura, Shinichi Fujiuchi, Yasumitsu Orii
Proc. of 21st Sodering Sectional Committee (Committee of Microjoining, Japan Welding Society), Tokyo, pp.7-14 (1996)
- Flip Chip Attach Technology by Au Bump and In Alloy Solder
I.Shohji, T.Yamada and H.Kimura
Proc. of IMC(International Microelectronics Conference)1996, Omiya, pp.314-317 (1996)
- Flip Chip Attach Technology by Chips Designed for Wire Bonding Connection
Ikuo Shohji, Takeshi Yamada, Hideo Kimura, Yasumitsu Orii, Shinichi Fujiuchi and Toshihiro Sakai
Proc. of Mate'96(Microjoining and Assembly Technology in Electronics), Yokohama, pp.17-22 (1996)
- The Development of Flip Chip Attach Technology by Other Metal Bump
Ikuo Shohji, Takeshi Yamada and Hideo Kimura
Proc. of MES'95（Micro Electronics Symposium'95), Omiya, pp127-130 (1995)
- The Design of Flipchip Joint by Other Metal Bump - Flip Chip Attach Technology
Y.Tsukada, N.Watanuki, S.Okamoto and I.Shohji
Proc. of IMC(International Microelectronics Conference)1994, Omiya, pp.419-424 (1994)
List of Papers
List of Ikuo Shohji's Papers