論文リスト

投稿論文

  • Sn-Sb-Ag 系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響
    山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
    スマートプロセス学会誌, Vol.11, No.5, pp.194-201 (2022)
  • 半導体パッケージ検査用プローブ材と Sn-58Bi はんだ界面における反応層成長過程
    渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁
    スマートプロセス学会誌, Vol.11, No.5, pp.188-193 (2022)
  • An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating
    Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi
    Materials Transactions, Vol.63, No.6, pp.821-828 (2022)
    【DOI:10.2320/matertrans.MT-MC2022012】
  • Formation of Cu­Ni Alloy Plating Film for Improving Adhesion between Metal and Resin
    Tatsuya Kobayashi, Akifumi Kubo and Ikuo Shohji
    Materials Transactions, Vol.63, No.6, pp.800-804 (2022)
    【DOI:10.2320/matertrans.MT-MC2022002】
  • Investigation of Mechanical Properties of High Tg Epoxy Resin Material
    Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI
    スマートプロセス学会誌, Vol.10, No.6, pp.365-371 (2021)
  • 電子実装用エポキシ樹脂および Ni/ 樹脂接着部の吸水劣化挙動
    三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也
    スマートプロセス学会誌, Vol.10, No.6, pp.359-364 (2021)
  • Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits
    Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi
    Journal of Electroanalytical Chemistry, 897, 115582 (2021)
    【DOI: https://doi.org/10.1016/j.jelechem.2021.115582】
  • Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment
    Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and
    Yuichiro Kamakoshi
    Materials, 14, 4237 (2021) 
    【DOI:https://doi.org/10.3390/ma14154237】
  • Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited
    Ni-Cr-P Alloy Coating
    Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake,
    Katsufumi Inoue and Hiroki Yamamoto
    Materials, 14, 4216 (2021) 
    【DOI: https://doi.org/10.3390/ma14154216】
  • Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated
    by Friction Stir Spot Welding
    Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi
    Materials, 14, 3877 (2021)  
    【DOI:https://doi.org/10.3390/ma1414387】
  • Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag
    Lead-Free Solder
    Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe
    Materials, 14, 3799 (2021)  
    【DOI:https://doi.org/10.3390/ma14143799】
  • Recent Development of Joining and Conductive Materials for Electronic Components
    Tatsuya Kobayashi, Tetsuya Ando
    Materials Transactions (2021) 
    【DOI:https://doi.org/10.2320/matertrans.MT-M2021060】
  • Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film
    T. Kobayashi, I. Shohji
    Materials and Manufacturing Processes (2021) 
    【DOI:10.1080/10426914.2021.1885708】
  • Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint with Surface
    Treatment Using Electrolyzed Water
    Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai
    Materials Science Forum, Vol. 1016, pp. 1466-1472 (2021)
  • Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under
    High Temperature and High Humidity Aging
    Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka
    Materials Science Forum, Vol. 1016, pp. 1436-1442 (2021)
  • Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding for Multi-Material
    Components
    Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota
    Materials Science Forum, Vol. 1016, pp. 774-779 (2021)
  • Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition for
    joining dissimilar materials
    Tatsuya Kobayashi, Ikuo Shohji
    Materials Science Forum, Vol. 1016, pp. 738-743 (2021)
  • Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of CorrosionBehavior
    Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi,
    Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi
    Materials Science Forum, Vol. 1016, pp. 522-527 (2021)
  • Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響
    三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦
    スマートプロセス学会誌, Vol.9, No.3, pp.133-139 (2020)
  • ステンレス鋼製熱交換器用Niろうの腐食挙動
    深井祐佑, 荘司郁夫, 小林竜也, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇
    スマートプロセス学会誌, Vol.9, No.3, pp.127-132 (2020)
  • 接着継手の高温高湿環境下における樹脂材凝集力および接着界面の劣化挙動調査
    安孫子瞳, 荘司郁夫, 小林竜也, 冨田雄吾, 松永達則
    スマートプロセス学会誌, Vol.9, No.2, pp.75-81 (2020)
  • Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with
    Small Amount of Ni Using Miniature Size Specimens
    Tatsuya Kobayashi, Ikuo Shohji
    Metals 2019, Volume 9, Issue 12, 1348 (2019)
  • Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and
    Mechanical Properties
    Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji
    Materials Transactions, Vol.60, No.6, pp.888-894 (2019)
  • Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder
    Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji
    Materials Science Forum, Vol. 941, pp.2081-2086 (2018)
  • Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder
    Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata
    Materials Science Forum, Vol. 941, pp.2075-2080 (2018)
  • Investigation of Crack Initiation in Glass Substrate by Residual Stress Analysis
    Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura
    Materials Science Forum, Vol. 941, pp.2069-2074 (2018)
  • Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process
    Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, Tatsuya Kobayashi and Ikuo Shohji
    Materials Science Forum, Vol. 941, pp.552-557 (2018)
  • Microstructures and Mechanical Properties of Welded Joints of Several High Tensile Strength Steel
    Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga
    Materials Science Forum, Vol. 941, pp.224-229 (2018)
  • 高温高湿環境下における銅/エポキシ樹脂界面の劣化寿命評価
    戸野塚悠, 小林竜也, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳
    スマートプロセス学会誌, Vol.7, No.4, pp.128-134 (2018)
  • Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size
    Specimens
    Tatsuya Kobayashi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
    Advances in Materials Science and Engineering, Volume 2018, Article ID 1416942 (2018)
  • Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder
    Joints
    Tatsuya Kobayashi, Ikuo Shohji, and Yusuke Nakata
    Advances in Materials Science and Engineering, Volume 2018, Article ID 4829508 (2018)
  • Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens
    Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
    Solid State Phenomena, Vol. 273, pp.83-90 (2018)
  • Sn-3Ag-0.5Cu はんだと W 基板上めっきメタライズ界面に生成する Sn-W 構造
    依田智子, 原田正英, 西川徹, 小林竜也, 荘司郁夫
    スマートプロセス学会誌, Vol. 3, No. 4, pp.232-239 (2014)
  • Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu
    Solder Ball
    Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
    Key Engineering Materials, 462-463, pp.849-854 (2011)
  • Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package
    Solder Joints
    Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
    Key Engineering Materials, 462-463, pp.76-81 (2011)