1. Creation of Functional Surfaces and Application for Joints
S. Koyama, T. Muraoka, K. Ozawa
Symposium on the Reserch Activities of Joint Usage/Research Center on Joining
and Welding, Osaka, Japan, November (2019)
2. FT-IR Analysis of Formate Coating Treatment Surface to Realize a Cu
Direct Bonding
T. Ishikawa, S. Koyama, T. Muraoka, H. Tanisawa, A. Iwabuchi
2019 Taiwan-Japan Workshop on Electronic Interconnection III, Taipei, Taiwan,
October (2019)
3. Influence of nitriding temperature on mechanical and tribological properties
of Titanium
T. Chen, S. Koyama
14th International Conference on the Physical Properties and Application
of Advanced Material (ICPMAT2019), Daegu, Republic of Korea, September
(2019)
4. FT-IR Analysis of Formate Coating Treatment Surface to Realize a Cu
Direct Bonding
T. Ishikawa, S. Koyama, T. Muraoka, H. Tanisawa, A. Iwabuchi
2019 Taiwan-Japan Workshop on Electronic Interconnection III, Taipei, Taiwan,
October (2019)
5. Effect of Formate Coating Treatment on Bond Strength of A5052/SUS316L
T. Ishikawa, S. Koyama, S. Tsuruoka, R. Kitamori
72th IIW Annual Assembly and International Conference, Bratislava, Slovakia,
July (2019)
6. Improvement of Mechanical Properties by T6 Heat Treatment of Aluminum
Casting Alloy Joint with Formate Coated Zn Sheet
Y. Shinohara, S. Koyama
72th IIW Annual Assembly and International Conference, Bratislava, Slovakia,
July (2019)
7. Influence of Processing Conditions on Boronizing of SCM440 Steel by
Al Added Fused Salt Bath
S. Yoshida, S. Koyama
72th IIW Annual Assembly and International Conference, Bratislava, Slovakia,
July (2019)
8. Influence of Processing Temperature on Boriding of Cold Work Steel by
Al Added Fused Salt Bath
N. Akimoto, S. Koyama
8th International Conference New Methods of Damage and Failure Analysis
of Structural Parts, Ostrava, Czech Republic, September (2018)
9. Solid-State Bonding of INCONEL600 by Formic Acid Metal Salt Generation
Bonding Technique
Y. Arai, K. Wen, S. Koyama
8th International Conference New Methods of Damage and Failure Analysis
of Structural Parts, Ostrava, Czech Republic, September (2018)
10. Effect of Metal Salt Coated Zn Sheet on Liquid Phase Diffusion Bonding
of A7075
Y. Fujimori, S. Koyama
8th International Conference New Methods of Damage and Failure Analysis
of Structural Parts, Ostrava, Czech Republic, September (2018)
11. Diffusion Bonding of INCONEL600 by Metal Salt Generation Bonding Technique
with Acetic Acid
Y. Arai, K. Wen, S. Koyama
2018 Japan-Taiwan Workshop on Electronic Interconnection II, Kuwana, Japan,
April (2018)
12. Dffusion Bonding of INCONEL600 by Metal Salt Generation Bonding Technique
with Formic Acid
K. Wen, Y. Arai, S. Koyama
2018 Japan-Taiwan Workshop on Electronic Interconnection II, Kuwana, Japan,
April (2018)
13. The Effect of Boriding on Wear Resistance of Cold Work Tool Steel
Y. Anzawa, S. Koyama, I Shohji
Fracture Fatigue and Ware (FFW2017), Porto, Portugal, July (2017)
14. Liquid Phase Diffusion Bonding of A1070 by Using Metal Formate Coated
Zn Sheet
K. Ozawa, S. Koyama, I. Shohji
Fracture Fatigue and Ware (FFW2017), Porto, Portugal, July (2017)
15. A6061/SUS316Lの固相接合強度に及ぼすギ酸を用いた金属塩生成処理の効果
齋藤広輝, 石原重憲, 鶴岡茂樹, 小山真司, 荘司郁夫
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.445-446
(2017), 横浜
16. (001)および(111)配向銀めっき皮膜のセルフアニーリング過程における再結晶挙動
林佑美, 荘司郁夫, 小山真司, 宮澤寛
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.439-440
(2017), 横浜
17. 電気化学的測定法を用いた銅及び銅合金の腐食特性に及ぼすブライン中の防錆剤の影響調査
樋口和成, 荘司郁夫, 小山真司, 安藤哲也, 水谷佳一, 井上行雄
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.419-424
(2017), 横浜
18. インサート材の金属塩被膜付与条件の最適化と鋳造用Al合金の接合界面への適用
西城舜哉, 小山真司, 荘司郁夫
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.401-404
(2017), 横浜
19. 構造用接着剤の接着強度の劣化に及ぼす破壊形態および加水分解の影響
冨田雄吾, 荘司郁夫, 小山真司, 清水誠吾
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.227-230
(2017), 横浜
20. 時効による高分子結合の変化に伴うエポキシ樹脂と銅との接着強度劣化挙動
戸野塚悠, 荘司郁夫, 小山真司, 外薗洋昭
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.223-226
(2017), 横浜
21. ピラー状金属間化合物分散鉛フリーはんだ接合部の生成に及ぼす諸条件の効果
林和, 荘司郁夫, 小山真司, 中田裕輔, 橋本富仁
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.155-158
(2017), 横浜
22. Sn-5Sbの機械的特性とパワーサイクル環境下におけるSn-5Sb接合部の特性変化
小林恭輔, 荘司郁夫, 小山真司, 外薗洋昭
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.141-144
(2017), 横浜
23. Sn-57Bi-1Ag鉛フリーはんだ接合部のミクロ組織と接合強度に及ぼす電極材の影響
丸屋優樹, 秦英恵, 荘司郁夫, 小山真司
Mate 2017(Microjoining and Assembly Technology in Electronics) Proc. pp.99-102
(2017), 横浜
24. Liquid Phase Diffusion Bonding of AC2C and ADC12 Aluminum Casting Alloy
by using Metal Salt Coated Zn Sheet
Shunya Saijo, Shinji Koyama, Ikuo Shohji
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 063, pp.72 (2016), Kuala Lumpur,
Malaysia
25. Fracture Behaviours of Miniature Size Specimens of Sn-5Sb Lead-free
Solder under Tensile and Fatigue Conditions
Kyosuke Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 062, pp.71 (2016), Kuala Lumpur,
Malaysia
26. Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper
Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani,
Yukio Inoue
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 058, pp.69 (2016), Kuala Lumpur,
Malaysia
27. Degradation Behaviors of Adhesion Strength Between Epoxy Resin and
Copper under Aging at HighTemperature
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 057, pp.69 (2016), Kuala Lumpur,
Malaysia
28. Degrdation Behaviors of Adhesion Strength of Structual Adhesive for
Weld-Bonding under HighTemperature and Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 055, pp.68 (2016), Kuala Lumpur,
Malaysia
29. Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder
to Gold-Plated Copper
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 054, pp.67 (2016), Kuala Lumpur,
Malaysia
30. Change of Several Characteristics in Self-annealing of (001) Oriented
Electrodeposited Silver Films
Yumi Hayashi, Ikuo Shohji, Shinji Koyama, Hiroshi Miyazawa
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 053, pp.67 (2016), Kuala Lumpur,
Malaysia
31. Effect of Bonding Time and Bonding Temperature on Lead-Free Solder
Joints Dispersed Pillar ShapedIMCS
Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomohito Hashimoto
ABSTRACTS & PROGRAMME BOOK of AMPT2016, 052, pp.66 (2016), Kuala Lumpur,
Malaysia
32. SOLID-STATE DIFFUSION BONDING OF TITANIUM BY USIG METAL SALT COATED
ALUMINUM SHEET
S. KOYAMA, N.V. PHU
7th International Conference, New Methods of Damage and Failure Analysis
of Structural Parts, pp. 39-40 (2016), 横浜
33. Improvement of Mechanical Properties of Pure Titanium by Boronization
and Nitridization by Al addedFused Salt Bath
Ryoya Ishino, Shohei Arai, Shinji Koyama
Final program of MS&T16, J-4, pp.162, (2016), Salt Lake City, Utah,
USA
34. Optimization of Formate Coating Conditions on Cu Powder and Its Application
for Solid-state Bonding of Cu/Cu Interface and Persistence of Reformed
Layer
Shunya Saijo, Shinji Koyama
Final program of MS&T16, pp.147, (2016), Salt Lake City, Utah, USA
35. Solid-state Bonding of 5052 Aluminum Alloy/316L Stainless Steel by
Using Organic Salt
Formation/decomposition Reaction
Hiroki Saito, Shinji Koyama
Book of abstracts of THERMEC'2016, 869, pp.477 (2016), Graz, Austria
36. SUS304鋼の固相接合強度に及ぼす金属塩被膜処理効果とその持続性
常藤達礼, 小山真司, 白鳥智美
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.429-430
(2016), 横浜
37. 純Al/SUS304の固相接合強度に及ぼす金属塩生成処理の効果
齋藤広輝, 小山真司
Mate 2016(Microjoining and Assembly Technology in Electronics) Proc. pp.199-202
(2016), 横浜
38. 金属塩被膜付与Znシートを用いたA5052合金の低温接合
冨川陽平, 小山真司
軽金属学会第129回秋季大会講演概要, Proc. pp.299-300 (2015), 千葉
39. Al添加溶融ほう砂浴を用いたチタンの耐摩耗性向上技術の開発
石野竜也，小山真司
軽金属学会第129回秋季大会講演概要, Proc. pp.145-146 (2015), 千葉
40. Solid-State Bonding of Casting Aluminum Alloy by Using Metal Salt Coated
Aluminum Sheet
Yohei Tomikawa, Shinji Koyama
Final program of MS&T15, pp.133 (2015), Columbus, Ohio, USA
41. Solid-State Bonding of Ni/Ni by Using Metal Salt Generation Bonding
Technique
Hiroki Saito, Shinji Koyama
Final program of MS&T15, pp.110 (2015), Columbus, Ohio, USA
42. 金属塩被膜付与Znシートの創製とA5052アルミニウム合金接合部への適用
馬小娟，冨川陽平，秋山主，小山真司
Mate2015(Microjoining and Assembly Technology in Electronics)Proc. pp.435-436
(2015), 横浜
43. 有機酸を用いた金属塩生成接合法によるTi/Alの固相接合条件の最適化
秋山主，小山真司
Mate2015(Microjoining and Assembly Technology in Electronics)Proc. pp.433-434
(2015), 横浜
44. ギ酸と酢酸を用いた金属塩生成接合法によるA6061合金の精密固相接合
冨川陽平，小山真司
Mate2015(Microjoining and Assembly Technology in Electronics)Proc. pp.383-386
(2015), 横浜
45. クエン酸を用いた金属塩生成接合法によるSUS304ステンレス鋼の固相接合
常藤達礼，小山真司
Mate2015(Microjoining and Assembly Technology in Electronics)Proc. pp.379-382
(2015), 横浜
46. Effect of coupling Treatment of Filler and Copper Substrate on Adhesion
of Underfill
Hironao Mitsugi, Ikuo Shohji, Shinji Koyama
Final program of MS&T14, p. 125(2014), Pittsburgh, Pennsylvania, USA
47. Direct Bonding of Cu/Cu by Metal Salt Generation Bonding Technique
with Formic Acid and Acetic Acid
Shinji Koyama, Naoki Hagiwara, Ikuo Shohji
6th International Conference, New Methods of Damage and Failure Analysis
of Structural Parts, pp. 115-116 (2014), Ostrava, Czech Republic
48. Direct Bonding of Ti/Al by Metal Salt Generation Bonding Technique
with Formic Acid
Tsukasa Akiyama, Shinji Koyama
6th International Conference, New Methods of Damage and Failure Analysis
of Structural Parts, pp. 107-108 (2014), Ostrava, Czech Republic
49. Direct Bonding of SUS304 Stainless Steel by Metal Salt Generation Bonding
Technique with Formic Acid
Tatsunori Tsuneto, Shinji Koyama
6th International Conference, New Methods of Damage and Failure Analysis
of Structural Parts, pp. 109-110 (2014), Ostrava, Czech Republic
50. Direct Bonding of A6061 Aluminum Alloy by Metal Salt Generation Bonding
Technique with Formic Acid
Yohei Tomikawa, Shinji Koyama
6th International Conference, New Methods of Damage and Failure Analysis
of Structural Parts, pp. 111-112 (2014), Ostrava, Czech Republic
51. Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength
of A5052 AluminumAlloy/Al and Cu/Al
Xiaojuan Ma, Shinji Koyama
6th International Conference, New Methods of Damage and Failure Analysis
of Structural Parts, pp. 113-114 (2014), Ostrava, Czech Republic
52. Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with
Organic Acid and Its Persistenceof Reformed Layer
S. Koyama, N. Hagiwara, I. Shohji
4th IEEE International Workshop on Low Temperature Bonding for 3D Intergration
(LTB-3D'2014), pp.147-148 (2014), Tokyo
53. 電気アシスト接合法によるAl/CuおよびAl/Alの固相接合
冨川陽平，小山真司
第107回マイクロ接合研究委員会資料, pp.35-40, (2014), 大阪
54. 酢酸を用いた金属塩生成接合法によるAl合金/SUS304の固相接合条件の緩和
松原広太，小山真司，荘司郁夫
Mate2014(Microjoining and Assembly Technology in Electronics)Proc. pp.389-390
(2014), 横浜
55. 金属塩生成接合法によるCu/Cu固相接合条件の緩和
萩原尚基，小山真司，荘司郁夫
Mate2014(Microjoining and Assembly Technology in Electronics)Proc. pp.387-388
(2014), 横浜
56. 双ロール法により作製した高Al含有Mg合金の時効硬化とミクロ組織
秋山主, 荘司郁夫, 小山真司, 西田進一, 渡利久規, 藤倉圭佑
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.373-376
(2014), 横浜
57. フリップチップ接合用アンダーフィル材の機械的物性に及ぼすカップリング剤の影響
三ツ木寛尚, 荘司郁夫, 小山真司, 北郷慎也
Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp.279-282
(2014), 横浜
58. Solid state bonding of Al alloy/SUS304 by metal salt generation bonding
technique with acetic acid
Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda, Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.396-397 (2013), Las Vegas, USA
59. A study of solid state bonding strength of nonferrous metals by using
metal salt generation bondingmethod
Shinji Koyama
Book of Abstracts of THERMEC’2013, pp.333 (2013), Las Vegas, USA
60. A Study of the Effect on Indium Filler Metal on the Bonding Strength
of Copper and Ting
Seng Keat Ting, Shinji Koyama, Yukinari Aoki, Naoki Hagiwara, Ikuo Shohji
Proc. of ICEP 2013 (CD-ROM), pp.55-59 (2013), Osaka
61. Cu/Cu direct bonding by metal salt generation bonding technique with
formic acid and citric acid
Naoki Hagiwara, Shinji Koyama, Ikuo Shohji
Book of Abstracts of THERMEC’2013, pp.216 (2013), Las Vegas, USA
62. フリップチップ接合用アンダーフィル材の材料物性に及ぼす温度およびフィラー添加量の影響
北郷慎也, 三ツ木寛尚, 荘司郁夫, 小山真司
Mate 2013(Microjoining and Assembly Technology in Electronics) Proc. pp.171-176
(2013), 横浜
63. A Study of Bonding Strength of Al/Cu by Metal Salt Generation Bonding
Method
S. K. Ting, Hirokazu Hata, Shinji Koyama and Ikuo Shohji
Proc. of Visual-JW2012, pp. 192-193, (2012), Osaka
64. A Study of Solid State Bonding Strength of Al/Cu by Using Metal Salt
Generation Bonding Methodon Al Surface
Shinji Koyama, S. K. Ting, Ikuo Shohji, Hirokazu Hata, Naoki Hagiwara and
Kota Matsubara
Proc. of Visual-JW2012, pp. 167-168 (2012), Osaka
65. Effect of Filler Content on Tensile Properties of Underfill Material
for Flip Chip Bonding
Shinya Kitagoh, Hironao Mitsugi, Shinji Koyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P150 (2012), Ipoh, Malaysia
66. Effect of Surface Modification by Citric Acid on Fluxless Vacuum Bonding
of Cu with Sn-Cu Alloy
Masumi Hayakawa, Shinji Koyama and Ikuo Shohji
Proc. of IEMT 2012, IEMT2012-P149 (2012), Ipoh, Malaysia
67. A Study of Low Temperature Solid State Bonding of Aluminum by the Metal
Salt Generation BondingMethod
S. Koyama, S. K. Ting, Shun Amari
The Second East Asia Symposium of Welding and Joining (２nd EAST-WJ 2012)
proceedings, 3.parallel session, A1-2(J3) (2012) Nara.
68. ソルダペーストぬれ性評価装置の開発と方法の提案
平本清，西室将，小山真司，荘司郁夫，宮本博永
第53回マイクロ接合研究委員会ソルダリング分科会資料, pp.27-38 (2012), 東京
69. ソルダペーストのぬれ性改善に向けた銅表面のクエン酸による改質作用
青木由希也, 小山真司
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.133-136
(2012), 横浜
70. Sn/Ni接合界面強度に及ぼすBi, Inフィラーの適用効果
伊坂俊宏, 小山真司
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.99-102
(2012), 横浜
71. Sn-Cu系鉛フリーはんだによるCuの真空接合部の接合部組織と接合強度
早川真生, 荘司郁夫, 小山真司, 奈良英明, 大友昇, 上西正久
Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.85-88
(2012), 横浜
72. 金属塩生成法を用いたSn/Cu固相接合の低温化
青木由希也，小山真司，荘司郁夫
第52回マイクロ接合研究委員会ソルダリング分科会資料，pp.65-70, (2011), 東京
73. Effect of the Organic Acid Surface Modification on Bond Strength of
Tin and Copper
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Proc. of InterPACK2011 (CD-ROM), IPACK2011-52072 (2011), Portland, USA
74. 錫に対する有機酸の表面改質作用と低温接合技術への応用
小山真司，大屋一生
第97回マイクロ接合研究委員会資料，Mate2011シンポジウム研究奨励賞受賞記念講演, pp.13-22, (2011), 東京
75. ギ酸による表面改質法を用いた錫とニッケルの低温固相接合法の検討
伊坂俊宏，小山真司
Mate2011(Microjoining and Assembly Technology in Electronics)Proc. pp.339-340(2011),
横浜
76. Sn/Cu固相接合界面強度に及ぼすクエン酸による表面改質作用
青木由希也，小山真司
Mate2011(Microjoining and Assembly Technology in Electronics)Proc. pp.337-338
(2011), 横浜
77. 錫に対する有機酸の表面改質作用と低温接合技術への応用
小山真司，大屋一生
Mate2011(Microjoining and Assembly Technology in Electronics)Proc. pp.73-78
(2011), 横浜.
78. Examination of improvement effect of surface modification of Cu with
organic acid on solder pastewettability using a laser displacement ｍeter
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Proc. of Visual-JW 2010, Vol. 1, pp.193-194 (2010), Osaka
79. Development of wettability evaluation equipment for solder paste using
laser displacement method
Shinji Koyama, Issei Oya, Toshihiro Isaka, Ikuo Shohji, Masashi Nishimuro,
Kiyoshi Hiramoto and Hironaga Miyamoto
Proc. of Visual-JW 2010, Vol. 1, pp.191-192 (2010), Osaka
80. 錫の酸化皮膜に対する有機酸の改質作用と固相接合強度への影響
小山真司，荘司郁夫
第95回マイクロ接合研究委員会資料, pp.55-62 (2010), 東京
81. Fabrication of Porous Aluminum by Friction Stir Processing Route Precursor
Method and its MechanicalProperties
Y. Hangai, O. Kuwazuru, S. Koyama, M. Hasegawa, T. Utsunomiya and N. Yoshikawa
Proceedings of the 12th International Conference on Aluminum Alloys, pp.2341-2344
(2010), Yokohama
82. 錫の固相接合界面強度と界面組織に及ぼす酢酸による改質作用
大屋一生，小山真司
Mate 2010(Microjoining and Assembly Technology in Electronics) Proc. pp.403-406
(2010), 横浜
83. 錫の酸化皮膜に対するギ酸の改質作用と接合強度への影響
小山真司，大屋一生
第48回マイクロ接合研究委員会ソルダリング分科会資料, MJS-305-2009 (2009), 東京
84. 錫の固相接合界面強度に対する有機酸の表面改質効果
小山真司，大屋一生
Mate 2009(Microjoining and Assembly Technology in Electronics) Proc. pp.371-374
(2009), 横浜
85. 錫の固相接合界面特性に及ぼす表面性状の影響
小山真司，池内建二
第88回マイクロ接合研究委員会資料, MJ-539-2008 (2008), 東京
86. Effects of Surface Treatments on Oxide Film of Tin during Diffusion
Bonding
S. Koyama, M. Takahashi and K. Ikeuchi
Proceedings of the 2006 Autumn Annual Meeting of Korean Welding Society,
Joint Symposium of Korea/Japan Welding Metallurgy Committee, pp.334-337
(2006), Busan,Korea
87. Behavior of Oxide Film in Transient-Liquid-Phase Bonding of Tin with
Filler of Bismuth Film
S. Koyama, M. Takahashi and K. Ikeuchi
Book of Abstracts THERMEC'2006 (5th International Conference on Processing
& Manufacturing of Advanced Materials), pp.274 (2006), Vancouver, Canada
88. Behavior of Superficial Oxide at Diffusion-Bonded Interface of Tin
and its Influence on Bond Strength
S.Koyama, M.Takahashi and K.Ikeuchi
Ceramic Transactions,Vol.198 (Proceedings of the Second International Conference
on Characterization and Control of Interfaces for High Quality Advanced
Materials) (2006), Kurashiki
89. Influence of Surface Treatment on Interfacial Microstructure and Bond
Strength of Diffusion-Bonded Tin
S. Koyama, M. Takahashi and K. Ikeuchi
15th International Symposium on the Reactivity of Solids (2003), Kyoto